Skip to content
6CCVD Research

Research progress of diamond/aluminum composite interface design

At a Glance

Section titled ā€œAt a Glanceā€
MetadataDetails
Publication Date2022-07-14
JournalFunctional Diamond
AuthorsZengkai Jiao, Huiyuan Kang, Bo Zhou, Aolong Kang, Xi Wang
InstitutionsQueen Mary University of London, Central South University
Citations19

Abstract

Section titled ā€œAbstractā€

Diamond/aluminum composite material has the advantages of high thermal conductivity, low expansion, and lightweight, which has a wide range of application prospects in the field of electronic packaging thermal management. However, the serious interface problems between diamond and aluminum limit the full play of the thermal conductivity of composite materials. A reasonable interface design can maximize the thermal conductivity of composite materials. This article focuses on the interface modification of diamond/aluminum composites, briefly describing the theoretical basis of interface design, the research status of interface modification, interface reaction and composite stability, and prospects for diamond/aluminum composites material development.

Tech Support

Section titled ā€œTech Supportā€

Original Source

Section titled ā€œOriginal Sourceā€

References

Section titled ā€œReferencesā€
  1. 2011 - Advanced materials for thermal management of electronic packaging

Reads Similar to This

Reduced thermal boundary conductance in GaN-based electronic devices introduced by metal bonding layer Concrete Grinding Residue - Its Effect on Roadside Vegetation and Soil Properties Optimizing a photon absorber using conformal cooling channels and additive manufacturing in copper