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6CCVD Research

Cutting of Diamond Substrate Using Fixed Diamond Grain Saw Wire

At a Glance

Section titled ā€œAt a Glanceā€
MetadataDetails
Publication Date2022-08-11
JournalMaterials
AuthorsOsamu KAMIYA, Mamoru Takahashi, Yasuyuki Miyano, Shinichi Ito, Masanobu Nakatsu
InstitutionsNippon Koei (Japan), Akita University
Citations1
AnalysisFull AI Review Included

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View Original Abstract

This study demonstrates that a single-crystal diamond substrate can be cut along designed lines using the diamond-saw-wire cutting method. We developed an original saw-wire fixed diamond-grain using a bronze solder with a high melting temperature. We created a unique product machine system with a high vacuum furnace and a bronze solder that contains a metallic compound. The diamond cutting mechanism employed in this study is based on the mild wear phenomenon, owing to the friction between the diamond surfaces. A linear relationship between the cutting length and wire feed distance was observed. The relationship can be approximated as y = 0.3622x, where y (Ī¼m) is the cutting depth and x (km) is the wire feed distance. The life of the saw-wire was longer than that of the 6000 km wire feed distance and was tested by reciprocating an 8-m short wire at a speed, tension, and cutting force of 150 m/min, 1 N, and 0.2 N, respectively. A single crystal diamond substrate could be cut along the designed line, which was more than 2 mm long. The cutting speed was maintained constant at 0.36 Ī¼m/km.

Tech Support

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Original Source

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References

Section titled ā€œReferencesā€
  1. 2022 - Two-Inch High Quality Diamond Heteroepitaxial Growth on Sapphire for Power Devices
  2. 1997 - Modern Diamond Cutting and Polishing [Crossref]
  3. 2007 - An Experimental Study on Laser Cutting Mechanisms of Polvcrvstalline Diamond Compacts [Crossref]
  4. 2021 - Sawing Characteristics of Diamond Wire Cutting Sapphire Crystal Based on Tool Life Cycle [Crossref]
  5. 2009 - CVD Diamond/Substrate Interface FIB Preparation of Cutting Tools [Crossref]
  6. 2018 - Diamond Wire Sawing of Solar Silicon Wafers: A Sustainable Manufacturing Alternative to Loose Abrasive Slurry Sawing [Crossref]

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