High-Frequency Surface Acoustic Wave Resonator with Diamond/AlN/IDT/AlN/Diamond Multilayer Structure
At a Glance
Section titled âAt a Glanceâ| Metadata | Details |
|---|---|
| Publication Date | 2022-08-28 |
| Journal | Sensors |
| Authors | Lei Liang, Bo Dong, Yuxuan Hu, Yisong Lei, Zhizhong Wang |
| Institutions | Shenzhen Technology University |
| Citations | 15 |
| Analysis | Full AI Review Included |
Executive Summary
Section titled âExecutive SummaryâThis research presents a novel, high-performance Surface Acoustic Wave (SAW) resonator utilizing a multilayer structure with a sandwiched Interdigital Transducer (IDT). The design, Diamond/AlN/IDT/AlN/Diamond on a Si substrate, is optimized via Finite Element Method (FEM) simulation to achieve superior frequency and coupling characteristics compared to traditional IDT-free surface structures.
- Novel Structure: The IDT is embedded (sandwiched) within two layers of Aluminum Nitride (AlN) and capped by two layers of high-velocity Diamond film, all resting on a Silicon (Si) substrate.
- Ultra-High Frequency: The optimized structure successfully excites the higher-order M2 mode (Love wave), achieving an operational resonance frequency ($f_r$) of 6.15 GHz.
- High Phase Velocity: The phase velocity ($v_p$) is significantly enhanced, reaching 12,470 m/s, which is crucial for high-frequency operation and miniaturization.
- Strong Coupling: The electromechanical coupling coefficient ($K^{2}$) is high at 5.53%, enabling wider bandwidth and improved acoustoelectric conversion efficiency.
- Thermal Stability: The device exhibits excellent temperature stability, characterized by a Temperature Coefficient of Frequency (TCF) of -6.3 ppm/°C.
- Performance Gain: This design offers substantial improvements over the traditional IDT/AlN/diamond/Si structure (which yielded $f_r$ = 1.26 GHz, $v_p$ = 7,620 m/s, and $K^{2}$ = 1.55%).
Technical Specifications
Section titled âTechnical SpecificationsâThe following specifications are based on the optimized M2 mode (Love wave) simulation results for the Diamond/AlN/IDT/AlN/Diamond structure.
| Parameter | Value | Unit | Context |
|---|---|---|---|
| Operation Frequency ($f_r$) | 6.15 | GHz | Optimized M2 mode resonance |
| Antiresonance Frequency ($f_{ar}$) | 6.32 | GHz | Optimized M2 mode |
| Electromechanical Coupling ($K^{2}$) | 5.53 | % | Optimized M2 mode performance |
| Phase Velocity ($v_p$) | 12,470 | m/s | Optimized M2 mode |
| Temperature Coefficient of Frequency (TCF) | -6.3 | ppm/°C | Measured between 25 °C and 40 °C |
| Wavelength (λ) | 2.0 | ”m | IDT periodicity used in simulation |
| AlN Layer Thickness ($h_{AlN}$) | 1.8 (0.9λ) | ”m | Optimized piezoelectric layer thickness |
| Diamond Layer Thickness ($h_{Dia}$) | 1.0 (0.5λ) | ”m | High sound speed layer thickness |
| Al Electrode Thickness ($h_{Al}$) | 0.15 (0.075λ) | ”m | Optimized metal thickness |
| Substrate Material | Si | N/A | Base material |
| Piezoelectric Material Orientation | AlN (002) | N/A | Euler angles (0°, 0°, 0°) |
| Comparison $K^{2}$ (Traditional M1) | 1.55 | % | Traditional IDT/AlN/diamond/Si structure |
| Comparison $v_p$ (Traditional M1) | 7,620 | m/s | Traditional IDT/AlN/diamond/Si structure |
Key Methodologies
Section titled âKey MethodologiesâThe SAW resonator characteristics were determined using the Finite Element Method (FEM) via COMSOL Multiphysics software.
- Modeling Environment: The structural mechanics module was used to solve the coupled piezoelectric constitutive relations and the general partial differential equation for the quasi-static state.
- Structure Definition: A unit cell model was established, representing the Diamond/AlN/IDT/AlN/Diamond stack on a Si substrate. Aluminum (Al) was selected for the IDT electrode material.
- Boundary Conditions (Mechanical):
- A Perfect Matching Layer (PML) with a thickness of 0.5λ was added to the bottom of the Si substrate to absorb wave reflections.
- The bottom boundary (PML) was set as a fixed constraint.
- Periodic boundary conditions were applied to the front, back, left, and right boundaries to simulate an infinite, uniform IDT array.
- Boundary Conditions (Electrical):
- One IDT electrode ($\Gamma_6$) was set to 1 V.
- The adjacent electrode ($\Gamma_7$) and the Si substrate ($\Gamma_5$) were connected to ground.
- Material Parameters: Published elastic constants, piezoelectric constants, relative dielectric constants, and their temperature coefficients for AlN, Diamond, Al, and Si were incorporated, including mechanical and dielectric losses ($\eta_{CE}$ and $\eta_{\epsilon S}$) set at 0.010 for AlN.
- Geometric Optimization: The ratios $h_{AlN}/\lambda$ and $h_{Al}/\lambda$ were systematically varied to identify the optimal geometry that maximized $K^{2}$ and $v_p$ while maintaining low dispersion, focusing specifically on the higher-order M2 mode.
- Performance Metrics: Phase velocity ($v_p$) and electromechanical coupling coefficient ($K^{2}$) were calculated from the simulated resonant ($f_r$) and anti-resonant ($f_{ar}$) frequencies. TCF was derived by comparing $f_r$ at 25 °C and 40 °C.
Commercial Applications
Section titled âCommercial ApplicationsâThe high frequency, high phase velocity, and excellent thermal stability achieved by this sandwiched multilayer structure make it highly valuable for advanced electronic and sensing applications.
- 5G/6G Wireless Communication: The 6.15 GHz operating frequency is directly applicable to high-frequency RF filters and duplexers required for modern cellular and broadband communication systems.
- High-Performance RF Front-Ends: The high electromechanical coupling coefficient ($K^{2}$ = 5.53%) allows for the design of wide-bandwidth filters, essential for minimizing signal loss and improving data throughput in mobile devices.
- Thermal Management in RF Devices: Utilizing diamond, which has thermal conductivity 2.5-3 times greater than traditional materials, significantly improves heat dissipation, enhancing the power handling and reliability of high-power RF components.
- Stable SAW Sensors: The low TCF (-6.3 ppm/°C) ensures frequency stability across temperature variations, making the device suitable for highly reliable wireless sensors (e.g., pressure, chemical, and biological) operating in industrial or automotive environments.
- Acoustofluidics and Micro-Manipulation: The high phase velocity and frequency enable precise, high-speed acoustic streaming and particle manipulation in miniaturized lab-on-chip systems.
View Original Abstract
A high-frequency surface acoustic wave (SAW) resonator, based on sandwiched interdigital transducer (IDT), is presented. The resonator has the structure of diamond/AlN/IDT/AlN/diamond, with Si as the substrate. The results show that its phase velocity and electromechanical coupling coefficient are both significantly improved, compared with that of the traditional interdigital transduce-free surface structure. The M2 mode of the sandwiched structure can excite an operation frequency up to 6.15 GHz, with an electromechanical coupling coefficient of 5.53%, phase velocity of 12,470 m/s, and temperature coefficient of frequency of â6.3 ppm/°C. This structure provides a new ideal for the design of high-performance and high-frequency SAW devices.
Tech Support
Section titled âTech SupportâOriginal Source
Section titled âOriginal SourceâReferences
Section titled âReferencesâ- 2013 - Surface acoustic wave microfluidics [Crossref]
- 1991 - Advanced channelization for RF, microwave, and millimeterwave applications [Crossref]
- 1973 - Propagation of acoustic surface waves in multilayers: A matrix description [Crossref]
- 2013 - Simulation on effects of electrical loading due to interdigital transducers in surface acoustic wave resonator [Crossref]
- 2017 - Enhanced performance of 17.7 GHz SAW devices based on AlN/diamond/Si layered structure with embedded nanotransducer [Crossref]
- 2021 - Structure with thin SiOx/SiNx bilayer and Al electrodes for high-frequency, large-coupling, and low-cost surface acoustic wave devices [Crossref]
- 2019 - High-velocity non-attenuated acoustic waves in LiTaO3/quartz layered substrates for high frequency resonators [Crossref]
- 2019 - Ultra high frequency acoustic wave propagation in fully polymer based surface acoustic wave device [Crossref]
- 2020 - 3D layout of interdigital transducers for high frequency surface acoustic wave devices [Crossref]
- 2019 - High-frequency V-doped ZnO/SiC surface acoustic wave devices with enhanced electromechanical coupling coefficient [Crossref]