Skip to content
6CCVD Research

Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique

At a Glance

Section titled ā€œAt a Glanceā€
MetadataDetails
Publication Date2023-02-26
JournalNanomaterials
AuthorsYaqiang Li, Hongyu Zhou, Chunjing Wu, Zheng Yin, Chang Liu
InstitutionsBaise University, University of Science and Technology Beijing
Citations10

Abstract

Section titled ā€œAbstractā€

Diamond/Cu composites are widely studied as a new generation of thermal management materials in the field of electronic packaging and heat sink materials. The surface modification of diamond can improve interfacial bonding between the diamond and Cu matrix. The Ti-coated diamond/Cu composites are prepared via an independently developed liquid-solid separation (LSS) technology. It is worth noting that there are obvious differences for the surface roughness between the diamond-{100} and -{111} face by AFM analysis, which may be related to the surface energy of different facets. In this work, the formation of titanium carbide (TiC) phase makes up the chemical incompatibility between the diamond and copper, and the thermal conductivities of 40 vol.% Ti-coated diamond/Cu composites can be improved to reach 457.22 WĀ·māˆ’1Ā·Kāˆ’1. The results estimated by the differential effective medium (DEM) model illustrate that the thermal conductivity for 40 vol.% Ti-coated diamond/Cu composites show a dramatic decline with increasing TiC layer thickness, giving a critical value of ~260 nm.

Tech Support

Section titled ā€œTech Supportā€

Original Source

Section titled ā€œOriginal Sourceā€

References

Section titled ā€œReferencesā€
  1. 2006 - Thermal Materials Solve Power Electronics Challenges
  2. 2008 - Thermal conductivity of Al-SiC composites with monomodal and bimodal particle size distribution [Crossref]
  3. 2010 - Reinforcement architectures and thermal fatigue in diamond particle-reinforced aluminum [Crossref]
  4. 2014 - Emerging challenges and materials for thermal management of electronics [Crossref]
  5. 2018 - Effect of Ti interlayer on interfacial thermal conductance between Cu and diamond [Crossref]
  6. 2019 - Understanding the thermal conductivity of Diamond/Copper composites by first-principles calculations [Crossref]
  7. 2012 - Fabrication and infiltration kinetics analysis of Ti-coated diamond/copper composites with near-net-shape by pressureless infiltration [Crossref]
  8. 1992 - The effect of particle size on the thermal conductivity of ZnS/diamond composites [Crossref]
  9. 1989 - Thermal boundary resistance [Crossref]
  10. 2018 - Thermal conductivity of copper-diamond composite materials produced by electrodeposition and the effect of TiC coatings on diamond particles [Crossref]

Reads Similar to This

Theoretical analysis of substrate effects on the DC performance of AlGaN/GaN high electron mobility transistor Influence of diamond particle size on the properties of diamond/Al composites fabricated by filtration extrusion Phonon propagation in isotopic diamond superlattices