Skip to content

Effect of crystallographic orientation on the potential barrier and conductivity of Bessel written graphitic electrodes in diamond

MetadataDetails
Publication Date2023-12-26
JournalDiamond and Related Materials
AuthorsAkhil Kuriakose, Andrea Chiappini, Pietro AprĂ , Ottavia Jedrkiewicz
InstitutionsUniversity of Turin, Istituto di Fotonica e Nanotecnologie
Citations6
AnalysisFull AI Review Included

This research investigates the critical role of crystallographic orientation in fabricating highly conductive, barrier-free graphitic microelectrodes within monocrystalline CVD diamond using pulsed Bessel beams.

  • Orientation Impact: The (110) crystallographic orientation completely eliminates the potential barrier observed in current-voltage (I-V) measurements, a barrier typically present in (100) oriented samples fabricated in the femtosecond (fs) regime.
  • Conductivity Achievement: Electrodes fabricated in (110) diamond achieved resistivities as low as 0.013 Ω cm (200 fs, 6 ”J), which is reported as one of the lowest values for in-bulk graphitic micro-electrodes written perpendicular to the surface using laser micromachining.
  • Morphological Advantage: (110) oriented wires are significantly thinner (approximately 1 ”m) and exhibit a smoother, more uniform core compared to the 2.5 ”m wires in (100) diamond.
  • Mechanism of Barrier Elimination: The absence of the potential barrier in (110) is attributed to an additional heating mechanism resulting from the directionality of cracking (along the beam path), which enhances diamond-to-sp2 carbon transformation and reduces microscopic gaps between graphitic globules.
  • Pulse Duration Effect: Fabrication in the picosecond (ps) regime (10 ps) eliminates the potential barrier in both (100) and (110) orientations, confirming that longer pulse durations generally lead to better sp2 conversion.
  • Thermal Annealing Effect: Annealing at 950 °C reduces the resistivity of the electrodes but has no effect on the height of the potential barrier when it is present.
ParameterValueUnitContext
Diamond TypeMonocrystalline CVD, Type IIaN/ASample material
Sample Thickness500”mDiamond substrate
Crystal Orientations Tested(100) and (110)N/ATop surface planes
Laser SystemTi:Sapphire AmplifiedN/A20-Hz repetition rate
Wavelength790nmLaser writing
Pulse Durations Tested200 fs and 10 psN/AFemtosecond and Picosecond regimes
Pulse Energy Range1 to 10”JEnergy used for fabrication
Bessel Beam Core Size2.7”mTransverse size of the central core
Bessel Zone Length700”mNon-diffracting length
Graphitic Wire Diameter ((110) cut)≈ 1”mTransverse size of conductive electrode
Graphitic Wire Diameter ((100) cut)≈ 2.5”mTransverse size of conductive electrode
Lowest Resistivity Achieved0.013Ω cm(110) cut, 200 fs, 6 ”J, after annealing
Annealing Temperature950°CUltra-high vacuum thermal treatment
Annealing Time1hourDuration of thermal treatment
I-V Voltage Range-450 to 450VElectrical characterization range
I-V Compliance Current25mAMaximum current limit
Potential Barrier Height ((100) cut, low energy)Up to 295VMeasured before ohmic behavior begins
Raman Diamond Peak1332.2cm-1Characteristic diamond signal
Raman Graphite G Peak≈ 1590cm-1Characteristic organized sp2 carbon signal

The fabrication and characterization process involved three main stages: laser micromachining, electrical/structural characterization, and post-processing thermal annealing.

  1. Bessel Beam Generation:

    • A 5 mm Gaussian beam (790 nm, linear polarization) was converted into a Bessel beam (BB) using a fused silica axicon (178° apex angle).
    • A telescopic system (250 mm lens and 0.45 N.A. 20× objective) focused the BB orthogonally onto the diamond surface.
    • The BB parameters resulted in a 12° cone angle, 2.7 ”m core, and 700 ”m Bessel zone, matching the 500 ”m sample thickness.
  2. Graphitic Wire Fabrication:

    • Microstructures were written in a transverse configuration without sample translation, utilizing the elongated focal zone of the BB.
    • Pulse durations of 200 fs and 10 ps were used, with pulse energies varied between 1 ”J and 10 ”J.
    • A multiple-shot regime was employed (9000 pulses per electrode) to ensure complete through-wires (500 ”m length).
  3. Electrical and Structural Characterization:

    • I-V Measurements: Conducted using a 2-probe configuration on a custom probe station after metal deposition (400 nm silver) on the electrode ends.
    • Morphology: Optical microscopy was used to analyze wire continuity, transverse size, and cracking phenomena.
    • Structural Analysis (Micro-Raman): Performed using a 532 nm DPSS laser to confirm the transformation of diamond (sp3) into amorphous/graphitic carbon (sp2).
  4. Thermal Annealing (Post-Processing):

    • Samples were annealed in a home-made chamber under ultra-high vacuum (up to 5 x 10-8 mbar).
    • The annealing temperature was fixed at 950 °C for 1 hour.
    • I-V measurements were repeated after annealing to assess changes in resistivity and potential barrier height.

The ability to rapidly fabricate high-quality, low-resistivity, three-dimensional conductive structures within insulating diamond bulk opens pathways for advanced devices in several high-tech sectors.

  • Radiation Detection:
    • 3D Diamond Detectors: Fabrication of 3D electrode geometries for highly energetic radiation detection, crucial for nuclear physics experiments and medical dosimetry.
  • Quantum and Photonic Devices:
    • Photonic Chips: Creation of integrated conductive channels for electric field generation within diamond photonic circuits, often used in conjunction with NV centers for quantum communication and sensing.
    • Microfluidic Sensing Systems: Integration of electrodes for biosensing and microfluidic control within diamond platforms due to diamond’s biocompatibility and chemical resistivity.
  • High-Performance Electronics:
    • High-Conductivity Interconnects: Utilizing the achieved low resistivity (0.013 Ω cm) for robust, high-speed electrical interconnects embedded within the diamond matrix, leveraging diamond’s superior thermal properties.
  • Laser Processing Technology:
    • Fast Fabrication: The use of pulsed Bessel beams allows for fast fabrication without sample translation, improving throughput for complex 3D microstructuring in transparent materials.
  1. 2000 - Diamond detectors in particle physics [Crossref]
  2. 2019 - Femtosecond laser written photonic and microfluidic circuits in diamond
  3. 2012 - Laser in micro and nanoprocessing of diamond materials [Crossref]
  4. 2016 - Diamond photonics platform enabled by femtosecond laser writing [Crossref]
  5. 2020 - A single-crystal diamond X-ray pixel detector with embedded graphitic electrodes [Crossref]
  6. 2017 - Planar diamond-based multiarrays to monitor neurotransmitter release and action potential firing: new perspectives in cellular neuroscience [Crossref]
  7. 1962 - The graphitization of diamond [Crossref]
  8. 2016 - Softening the ultra-stiff: controlled variation of Young’s modulus in single-crystal diamond by ion implantation [Crossref]
  9. 2012 - Fabrication and electrical characterization of three-dimensional graphitic microchannels in single crystal diamond [Crossref]