Optimized Design and Simulation Study of Liquid-Cooled Heat Sink Model for IGBT Module Based on TPMS Structure
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2024-06-17 |
| Journal | Journal of Thermal Science and Engineering Applications |
| Authors | Fuyin Wei, Xianglong Sun, Zhuopei Lv, Lixiang Cai, Feiqi Zhai |
| Institutions | Nanjing Normal University |
| Citations | 7 |
Abstract
Section titled āAbstractāAbstract In this article, we propose a liquid-cooled heat sink model utilizing a triple periodic minimal surface (TPMS) structure for insulated gate bipolar transistor (IGBT) modules. By using parametric modeling software ntopology, we establish the following three TPMS structures: Schwarz P, Gyroid, and Diamond. Thermal simulation analysis is conducted on the radiator model using ansys fluent. The optimal structural parameters are determined to ensure effective heat dissipation while preventing excessive pump power consumption due to inappropriate inlet flowrates. Simulation results demonstrate that the liquid-cooled radiator with the TPMS structure outperforms conventional radiators in heat transfer efficiency, albeit with higher inlet and outlet pressure drops. Among the TPMS-structured radiators, the Schwarz P configuration exhibits the lowest pressure drop, approximately 20% less than the remaining two, offering superior thermal management advantages.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- 2019 - Investigation of Heat Transfer and Thermal Stresses of Novel Thermal Management System Integrated With Vapour Chamber for IGBT Power Module [Crossref]
- 2020 - Comparative Analysis of IGBT Parameters Variation Under Different Accelerated Aging Tests [Crossref]
- 2018 - Thermal Management on IGBT Power Electronic Devices and Modules [Crossref]
- 2021 - Study of the Performance of an Integrated Liquid Cooling Heat Sink for High-Power IGBTs [Crossref]
- 2019 - Liquid Impingement Cooling of Cold Plate Heat Sink With Different Fin Configurations: High Heat Flux Applications [Crossref]
- 2022 - Thermal Performance of Insulated Gate Bipolar Transistor Module Using Microchannel Cooling Base Plate [Crossref]
- 2023 - Application of Novel Double-Layer Micro-Jet Heat Sinks for Energy-Efficient Thermal Management of Motor Inverters in Electric Vehicles [Crossref]
- 2014 - Direct Liquid Cooling for IGBT Power Module [Crossref]
- 2012 - Optimization of Short Micro Pin Fins in Minichannels [Crossref]
- 2020 - Liquid Cooling Module Incorporating a Metal Foam and Fin Hybrid Structure for High Power Insulated Gate Bipolar Transistors (IGBTs) [Crossref]