Thermal and thermo-mechanical behavior of internal silver-diamond heat spreaders for power electronic modules
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2024-09-25 |
| Authors | Aitor Casado Ramoneda, Yvan Avenas, Rabih Khazaka, Cyrille Gautier, Toni Youssef |
| Institutions | Institut polytechnique de Grenoble, Centre National de la Recherche Scientifique |
Abstract
Section titled āAbstractāThermal performance of SiC MOSFET power modules has become essential to increase the heat extraction given the higher density losses of such technology due to the reduction of the die area. Novel Silver Diamond (AgD) internal spreaders are presented as an effective and a simple solution to decrease temperature at the package level. The AgD spreader technology is compared to modules without spreaders and to modules with Molybdenum Copper alloy (70Mo30Cu) and copper spreaders. A parametric study is performed to investigate the interest in thermal performance improvement and assembly residual stress reduction. Silver diamond and copper spreader modules are manufactured, thermally characterized and compared with a design without spreader.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- 2019 - Development of innovative heat sinks for power electronics cooling within the more electrical aircraft
- **** - Reliability of Metallized Ceramic Substrates for Power Electronics Applications