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6CCVD Research

Quantitative control of interfacial structure and thermal conductivity between diamond and copper via thermal diffusion of alloying element

At a Glance

Section titled ā€œAt a Glanceā€
MetadataDetails
Publication Date2024-11-01
JournalJournal of Materials Research and Technology
AuthorsYizhe Cao, Bo Li, Lei Liu, Shaolong Li, Dongxu Hui
Citations6

Abstract

Section titled ā€œAbstractā€

The thermal property of diamond/metal composites mainly depends on the chemical bonding and structure of interfacial layers between two heterogeneous materials. To improve the thermal property of the diamond/metal composites, a metallic carbide layer that bridging both crystal structure and thermal transport of heterogeneous interfaces is required, though the formation mechanism of such carbide interfaces during powder sintering remains under debate, particularly for the scenario of varying thermal diffusion. Here, systematic experiments of diamond/Cu-Cr composites have been conducted to unravel the effects of two important variables for thermal diffusion, temperature (800-1025 Ā°C) and holding time (5-60 min), on the growth of chromium carbide interfaces and the resulting thermal conductivity. It is found that the main characteristics of chromium carbide layer is more related to the holding time, that is, prolonged thermal diffusion. The extraction of diamonds in as-sintered composites allows a detailed quantification of coating efficiency and crystallographic-facet-dependence of chromium carbide interfaces during diamond/metal reaction at varying temperature and holding times. It is found that the prolonged thermal diffusion is not as expected to deteriorate the thermal conductivity, and leads to a more densified structure with highest thermal conductivity instead (āˆ¼577 W/(mĀ·K)). Furthermore, thermal diffusion of diamond/metal reaction is discussed based on theoretical models. We theoretically demonstrate that long thermal diffusion could enhance the thermal diffusivity for the composites and achieve āˆ¼90.8% of theoretical thermal conductivity predicted by the Maxwell-Eucken model.

Tech Support

Section titled ā€œTech Supportā€

Original Source

Section titled ā€œOriginal Sourceā€

References

Section titled ā€œReferencesā€
  1. 2023 - Preparation of high thermal conductivity shaped diamond/copper composites by isostatic pressing [Crossref]
  2. 2020 - Microstructure and thermo-physical properties of CuTi double-layer coated diamond/Cu composites fabricated by spark plasma sintering [Crossref]
  3. 2016 - Graphite film/aluminum laminate composites with ultrahigh thermal conductivity for thermal management applications [Crossref]
  4. 2016 - Effect of filler arrangement and networking of hexagonal boron nitride on the conductivity of new thermal management polymeric composites [Crossref]
  5. 2014 - Emerging challenges and materials for thermal management of electronics [Crossref]
  6. 2023 - A review of diamond interfacial modification and its effect on the properties of diamond/Cu matrix composites
  7. 2023 - Progress in the copper-based diamond composites for thermal conductivity applications [Crossref]
  8. 2022 - Research progress in interface modification and thermal conduction behavior of diamond/metal composites [Crossref]
  9. 2011 - Review of metal matrix composites with high thermal conductivity for thermal management applications [Crossref]
  10. 2021 - High thermal conductive copper/diamond composites: state of the art [Crossref]

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