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Hydrothermal performance of microchannel heat sink integrating pin fins based on triply periodic minimal surfaces

MetadataDetails
Publication Date2025-01-14
JournalCase Studies in Thermal Engineering
AuthorsAhmed Raafat, Moza Alteneiji, Mohamed M. Kamra, Saeed K. Alnuaimi
Citations11

The increasing demand for high cooling performance and low power consumption in microchips has driven research toward microchannel heat sinks. Previous studies have explored attaching pin fins with conventional shapes, such as square pin fins, to increase surface area for enhanced cooling. However, this approach often comes at the cost of higher pressure drop and reduced efficiency. In this work, triply periodic minimal surfaces are investigated as pin fins for microchannels. These structures offer a high surface area-to-volume ratio, targeting high Nusselt numbers, while their porous-like topology reduces channel blockage, achieving balanced hydrothermal performance. A numerically validated model, supported by experimental data from literature, is employed to study and analyze three lattice based pin-fin designs, namely: the IWP pin fin, Hybrid A pin fin, and Hybrid B pin fin. The results show that the novel hybrid designs, which combine both square pin fins and the I-graph wrapped package-graph (IWP) lattice at their core, achieve a 54% reduction in pressure drop without compromising thermal performance, as indicated by average Nusselt numbers and maximum temperatures, compared to conventional square pins. Additionally, a 27% improvement in thermal efficiency was observed. This comprehensive study demonstrates the influence of triply periodic minimal surface structures on generating secondary cooling flows and disrupting thermal boundary layers. Finally, the findings encourage further exploration of other lattices, such as Gyroid and Diamond structures, which are expected to exhibit similar trends.

  1. 2017 - A critical review of traditional and emerging techniques and fluids for electronics cooling [Crossref]
  2. 2015 - MEMS heat exchangers
  3. 1981 - High-performance heat sinking for VLSI [Crossref]
  4. 2022 - Forced convection heat transfer in heat sinks with topologies based on triply periodic minimal surfaces [Crossref]
  5. 2014 - Advanced porous scaffold design using multi-void triply periodic minimal surfacemodels with high surface area to volume ratios [Crossref]
  6. 2005 - Fluid permeabilities of triply periodic minimal surfaces [Crossref]
  7. 2019 - Thermal conductivity of TPMS lattice structures manufactured via laser powder bed fusion
  8. 2018 - Topology-mechanical property relationship of 3D printed strut, skeletal, and sheet based periodic metallic cellular materials
  9. 2007 - Numerical simulation of stacked microchannel heat sink with mixing-enhanced passive structure [Crossref]
  10. 2008 - Numerical simulations of interrupted and conventional microchannel heat sinks [Crossref]