Diamond Wire Wear and Its Effect on Surface Quality in Cutting of Monocrystalline Silicon
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2025-04-12 |
| Journal | Materials |
| Authors | Jinguang Du, Yu Wu, Zhen Zhang, Yu Zhang, Wenbin He |
| Institutions | Zhengzhou University of Light Industry, Huazhong University of Science and Technology |
| Analysis | Full AI Review Included |
ERROR: File too large (16.9MB)
View Original Abstract
Monocrystalline silicon is widely used in the semiconductor industry. During wafer machining with a diamond wire saw (DWS), a worn diamond wire can affect the slicing quality. To assess the effect of diamond wire wear on wafer machining, in this study, the impact of diamond wire wear on the waferās total thickness variation (TTV) and surface quality was examined at a wire velocity of 1.8 m/s and a feed rate of 0.5 mm/min. Through a single-factor experiment, the effects of the wire velocity, feed rate, and workpiece thickness on diamond wire wear were explored. The outcomes demonstrate that the wear rate was higher in the early and late wear periods, and the wafer machining quality was poor in these two periods. During the stable wear period, the machined wafer exhibited high quality, while the wear rate remained stable. Under the condition of machining the same area of the workpiece, with an increase in wire velocity, the wear quantity for the diamond wire was reduced. As the feed rate and workpiece thickness increased, the wear quantity of the diamond wire increased. The diamond wire wear remained roughly constant when the wire velocity and feed rate increased at the same ratio.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- 2023 - Modeling of electroplated diamond wire and its application towards precision slicing of semiconductors [Crossref]
- 2014 - Effect of reciprocating wire slurry sawing on surface quality and mechanical strength of as-cut solar silicon wafers [Crossref]
- 2025 - Crystal surface heat transfer during the growth of 300mm monocrystalline silicon by the Czochralski process [Crossref]
- 2023 - Prospects of photovoltaic technology [Crossref]
- 2024 - Fracture strength analysis of large-size and thin photovoltaic monocrystalline silicon wafers [Crossref]
- 2018 - Diamond wire sawing of solar silicon wafers: A sustainable manufacturing alternative to loose abrasive slurry sawing [Crossref]
- 2015 - Evolution and present status of silicon carbide slurry recovery in silicon wire sawing [Crossref]
- 2016 - Experiment study on electroplated diamond wire saw slicing single-crystal silicon [Crossref]
- 2020 - Experimental and numerical analysis of scratching induced damage during diamond wire sawing of silicon [Crossref]