Experimental study on ultrasonic vibration-assisted diamond wire sawing of sic
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2025-06-01 |
| Journal | Journal of Physics Conference Series |
| Authors | Chao Yao, Ligang Zhao, Jiajun Zhu |
Abstract
Section titled āAbstractāAbstract The diamond wire saw, known for its narrow kerf and excellent flexibility, is widely used in the cutting of hard and brittle materials. Additionally, by incorporating an ultrasonic vibration device, the processing efficiency can be significantly enhanced, and surface roughness can be reduced, making it more advantageous for processing hard and brittle materials. This paper introduces the specific structure of the diamond wire saw ultrasonic composite processing system and the method of ultrasonic addition. Experiments were conducted using SiC as the test subject, comparing ultrasonic vibration-assisted cutting with non-ultrasonic vibration. The results indicate that the addition of ultrasonic vibration to the workpiece significantly improves cutting efficiency and surface quality.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
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