Development and experimental study of ultrasonic vibration-assisted diamond wire saw cutting equipment for SiC
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2025-07-01 |
| Journal | Journal of Physics Conference Series |
| Authors | Chao Yao, Ligang Zhao, Jiajun Zhu |
Abstract
Section titled āAbstractāAbstract Silicon carbide (SiC) is widely used in high-tech fields but is difficult to machine due to its hardness and brittleness. This study proposes an ultrasonic vibration-assisted diamond wire saw method to improve SiC machining. Simulations confirmed a resonant frequency of 19,515 Hz (within 19-21 kHz ) and a workpiece amplitude of 12 Ī¼m . Experiments showed that ultrasonic vibration reduced surface roughness from 0.831 Ī¼m to 0.588 Ī¼m , with smoother 3D profiles. The method enhances material removal and surface quality, offering an efficient solution for machining hard and brittle materials.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
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