Simulation and experimental study of diamond wire cutting silicone materials
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2025-07-01 |
| Journal | Journal of Physics Conference Series |
| Authors | Jiajun Zhu, Ligang Zhao, Chao Yao |
Abstract
Section titled āAbstractāAbstract Traditional cutting methods for flexible materials often fail to meet high-precision machining requirements during the processing. Diamond wire saw cutting technology has the characteristics of high machining accuracy and good surface quality. This article takes silicone as the research object, explores the mechanism of flexible material cutting by diamond wire saw, and analyzes the single particle grinding process of silicon material through diamond wire saw slicing experiments and finite element analysis software ABAQUS. By combining simulation results with subsequent experiments, it was found that the roughness of the slices decreases first and then increases with the increase of linear velocity. When the linear velocity is 1000 mm/s, the minimum surface roughness is 0.869 Ī¼m .
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
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