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Dry Etching Process for Solar Cell Manufacturing

MetadataDetails
Publication Date2015-01-01
Journal31st European Photovoltaic Solar Energy Conference and Exhibition
AuthorsY. Cuminal, S. Parola, A. Focsa, J.C. Loretz

In the crystalline silicon solar cell manufacturing wet etching process are widely used with a large usage of acid and DI water and with a limited capability of reflectivity reduction. In this work, we replace wet etching by plasma dry etching on 4 main processes. A new dry etch of saw damage coupled with front dry texturing and rear dry polishing provides the possibility to replace wet bench by new dry etching equipment. Batch processing drastically reduces the cost per wafer and increases the through put. Marathon test on 2000 multicrystalline wafers show a 0.2% absolute increase of efficiency compare to wet acidic etching. Compatibility with diamond wire sawn wafers is evaluated and at module level single cell mini module demonstrated no loss of performance on dry textured cells. In the last part, a dry plasma emitter rear emitter etch is developed. A fine adjustment of process parameters provides a gain in isolation and in Jsc corresponding to a 0.08% absolute efficiency gain.