Effect of Boron Addition on the Thermal Conductivity of Cu/Diamond Composites Fabricated by SPS
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2015-01-01 |
| Journal | Journal of the Japan Society of Powder and Powder Metallurgy |
| Authors | Kiyoshi Mizuuchi, Kanryu INOUE, Yasuyuki Agari, Masami Sugioka, Motohiro Tanaka |
| Institutions | University of Washington, Osaka Research Institute of Industrial Science and Technology |
| Citations | 6 |
Abstract
Section titled āAbstractāDiamond-particle-dispersed-copper (Cu) matrix composites were fabricated by spark plasma sintering (SPS) process from the mixture of diamond particles, pure-Cu and boron (B) powders. The microstructures and thermal conductivities of the composites fabricated were examined. These composites were all well consolidated at a temperature of 1173 K for 600 s by spark plasma sintering (SPS) process. No reaction at the interface between the diamond particle and the Cu matrix was observed by scanning electron microscopy and X-ray diffraction analysis for the composites fabricated under the sintering condition employed in the present study. The relative packing density of the diamond particle dispersed Cu matrix composites with B addition was 3.56.1 % higher than that without B addition. The thermal conductivity of the Cu/diamond composite drastically increased with B addition. The thermal conductivity of (Cu-B)-50 vol% diamond composites was 594689 W/mK in a volume fraction range of B between 1.8 and 13.8 vol% in Cu matrix. Numerous transgranular fractures of diamond particles were observed on the bending fracture surface of diamond particle dispersed Cu matrix composites with B addition, indicating strong bonding between the diamond particle and the Cu matrix in the composite.