Surface treatment for multi-crystalline silicon wafer sliced by diamond wire saw
At a Glance
Section titled âAt a Glanceâ| Metadata | Details |
|---|---|
| Publication Date | 2016-06-01 |
| Authors | Teng-Yu Wang, Wen-Jong Lih, Cheng-Yao Cheng, Jyun-Yi Liu, WenâHsin Lin |
| Institutions | Industrial Technology Research Institute |
| Citations | 1 |
Abstract
Section titled âAbstractâSilicon wafers sliced with diamond wire saw and SiC slurry are compared in this study. Diamond wire saw have high slicing speed and the cost is lower than slurry cut process. However it is not suitable for multi-crystalline wafer slicing process. In this study, a surface treatment process was used on the diamond wire cut multi-crystalline silicon wafer. With the modification of wafer surface, the surface quality and solar cell characteristics could be improved. The energy conversion efficiency was increased from 17.7% to 18.4%, which is comparable to the solar cell from conventional slurry cut. Furthermore, there is a decline in wafering cost.
Tech Support
Section titled âTech SupportâOriginal Source
Section titled âOriginal SourceâReferences
Section titled âReferencesâ- 2014 - The surface characteristics of diamond wire sawn multicrystalline silicon wafers and their acidic texturization [Crossref]
- 2012 - Thin Czochralski silicon solar cells based on diamond wire sawing technology [Crossref]