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6CCVD Research

Investigations of double layer UV-curing resin diamond wire saw

At a Glance

Section titled ā€œAt a Glanceā€
MetadataDetails
Publication Date2016-07-01
AuthorsChunyan Yao, Wei Zhang, Tengwei Qiu, Minghuan Wang, Xuefeng Xu
InstitutionsZhejiang University of Technology
Citations3

Abstract

Section titled ā€œAbstractā€

In view of poor resin flexibility and easy to fall off of diamond grits during manufacturing process of single layer UV-curing resin diamond wire saw, a novel manufacturing approach of double layer UV-curing resin diamond wire saw is put forward. During the manufacturing process, a layer of UV-curing resin with a good pliability and strong binding ability is uniformly coated on the core wire surface, then it is cured by the UV light. After that, a layer of UV-curing resin containing diamond grits is coated on the wire surface coated with resin. Another curing is conducted by the UV light. Then the double layer UV-curing resin diamond wire saw is manufactured. The cutting experiments of single and double layer UV-curing resin diamond wire saw are performed for silicon ingot at a single wire sawing machine. Experimental results show that the cutting efficiency of double layer UV-curing resin diamond wire saw is up to 26mm <sup xmlns:mml=ā€œhttp://www.w3.org/1998/Math/MathMLā€ xmlns:xlink=ā€œhttp://www.w3.org/1999/xlinkā€&gt;2&lt;/sup> /min. Compared with single layer UV-curing resin diamond wire saw, lower kerf loss and damage are found, which means a higher utilizing rate of silicon material is achieved. Surface roughness reduces from Ra4.595Āµm to Ra1.031Āµm. The cutting performance of double layer UV-curing resin diamond wire saw improves significantly.

Tech Support

Section titled ā€œTech Supportā€

Original Source

Section titled ā€œOriginal Sourceā€

References

Section titled ā€œReferencesā€
  1. 2006 - Research and application on the bonding mechanism of the Photosensitive resin blade
  2. 2004 - Develop resin bonded diamond wire saw using UV curing resin
  3. 2014 - Research on manufacturing technology of heat-curing diamond wire saw
  4. 2010 - Resin bonding wire saw
  5. 1999 - Wire saw and its manufacture
  6. 2009 - Reaching a Kerf Loss Below 100?m by Optimizing the Relation Between Wire Thickness and Abrasive Size for Multi-Wire Sawing

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