High power DUV lasers for material processing
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2016-11-09 |
| Journal | Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE |
| Authors | Toshio Mimura, Kouji Kakizaki, Hiroaki Oizumi, Masakazu Kobayashi, Junichi Fujimoto |
| Citations | 3 |
Abstract
Section titled āAbstractāA frontier in laser machining has been required by material processing in DUV region because it is hard to get high power solid-state lasers in this spectral region. DUV excimer lasers are the only solution, and now the time has come to examine the new applications of material processing with DUV excimer lasers. The excimer lasers at 193nm and 248nm have been used in the semiconductor manufacturing for long years, and have field-proven stability and reliability. The high photon energy of 6.4 eV at 193nm is expected to interact directly with the chemical bond of hard-machining materials, such as CFRP, diamond and tempered glasses. We report the latest results of material processing by 193nm high power DUV laser.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- 2016 - Development of DUV hybrid excimer laser for high quality and high power processing,
- 2016 - Development of high coherence high power 193 nm laser,