Development of fixed grain micro-saw wire and cutting performance
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2017-01-01 |
| Journal | Procedia Manufacturing |
| Authors | Osamu KAMIYA, Hirosuke Mori, Manabu Ito, Mamoru Takahashi, Y. Miyano |
| Institutions | Auckland University of Technology, Akita University |
| Citations | 7 |
Abstract
Section titled āAbstractāWe develop wire saws with the diamond grains bonded to the wires for non-slurry cutting process. We invented a special product machine which has a high vacuum furnace and a special solder that contain a metallic compound. In this paper we demonstrate the finest saw wire that is 50 Āµm of diameter tungsten (W) wires and can perform in cutting an extremely hard material which include the diamond substrate.