FEM thermal analysis of Cu/diamond/Cu and diamond/SiC heat spreaders
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2017-03-01 |
| Journal | AIP Advances |
| Authors | Garuma Abdisa Denu, Jibran Hussain Mirani, Jiao Fu, Zongchen Liu, Hongxing Wang |
| Institutions | Xiāan Jiaotong University, Mattu University |
| Citations | 11 |
Abstract
Section titled āAbstractāThe effects of thermal stress resulting from thermal cooling in copper/diamond/copper heat spreader is investigated using finite element method. A similar model of diamond/SiC heat spreader is compared without addition of interlayer. The effect of carbide interlayer in reduction of interfacial thermal stress is investigated. The results show that the carbide interlayer film thickness is critical in stress reduction for a copper/diamond/copper heat spreader device. Diamond/SiC device has lower interfacial stress without interlayer. The study of mechanical and thermal property of diamond heat spreader is useful for optimal designs of efficient heat spreader for electronic components.