Selection of materials for multilayered structures to be used in packageless sensors
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2017-09-01 |
| Journal | 2017 IEEE International Ultrasonics Symposium (IUS) |
| Authors | Natalya Naumenko |
| Institutions | National University of Science and Technology |
Abstract
Section titled āAbstractāAcoustic wave characteristics are numerically investigated and compared in AlN/ZnO/diamond and Al <sub xmlns:mml=āhttp://www.w3.org/1998/Math/MathMLā xmlns:xlink=āhttp://www.w3.org/1999/xlinkā>2</sub> O <sub xmlns:mml=āhttp://www.w3.org/1998/Math/MathMLā xmlns:xlink=āhttp://www.w3.org/1999/xlinkā>3</sub> /GaN/sapphire with Pt electrodes. These structures have been previously reported as candidates for application in packageless sensors. They include a low-velocity guiding piezoelectric layer sandwiched between two high-velocity materials. The anisotropy of the combined materials, their symmetry and the ratio between bulk acoustic wave velocities in the sagittal plane are compared to find the selection criterion for optimal combination of materials enabling high coupling of the useful mode and suppression of parasitic modes. Acoustic fields have been visualized for the reported structures and for Si <sub xmlns:mml=āhttp://www.w3.org/1998/Math/MathMLā xmlns:xlink=āhttp://www.w3.org/1999/xlinkā>3</sub> N <sub xmlns:mml=āhttp://www.w3.org/1998/Math/MathMLā xmlns:xlink=āhttp://www.w3.org/1999/xlinkā>4</sub> /GaN/sapphire, an alternative structure suggested to be used in packageless sensors, to understand the correlation between the acoustic fields and the wave characteristics.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- 0 - Optimal design for an innovative very high temperature hybrid SAW sensors
- 0 - Packageless WLAW devices based om A1203/Pt/GaN/sapphire structure for high-temperature applications