Research status of metal/diamond interface
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2018-01-01 |
| Journal | Proceedings of the 2018 3rd International Conference on Advances in Materials, Mechatronics and Civil Engineering (ICAMMCE 2018) |
| Authors | Chang Zhang, Fengbin Liu |
| Institutions | North China University of Technology |
Abstract
Section titled āAbstractāThe high thermal conductivity of diamond makes it very promising in the field of semiconductor devices, and the application of diamond film in electronic devices will inevitably involve the problem of contact with metal.What kind of metal/diamond interface that has good electrical and mechanical properties.Which method can obtain a more stable interface between the metal/diamond.Scientists have done a lot of research in these aspects, but there is no definite conclusion at present.This paper focuses on the preparation methods of metal/diamond interfaces, and the electrical and mechanical properties of the interfaces.