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Increasing the Work of the Diamond Grinding Circuits for the Account of Directed Changes in the Heat Conductivity of a Polymer Matrix

MetadataDetails
Publication Date2018-10-01
JournalMaterials science forum
AuthorsZalim N. Deunezhev

Numerical simulation has been used to study the temperature field in a diamond-containing composite on a polymer matrix. It is shown that an increase in the thermal conductivity of the matrix due to fillers provides a reduction in the thermal load on the polymer binder.