Microstructure and Properties of C/SiC‐Diamond Composites Prepared by the Combination of CVI and RMI
At a Glance
Section titled “At a Glance”| Metadata | Details |
|---|---|
| Publication Date | 2018-10-18 |
| Journal | Advanced Engineering Materials |
| Authors | Jingxin Li, Yongsheng Liu, Beiya Nan, Zhifeng Zhao, Wei Feng |
| Institutions | Northwestern Polytechnical University |
| Citations | 27 |
Abstract
Section titled “Abstract”Diamond modified continuous carbon fiber reinforced silicon carbide (C/SiC‐Diamond) composites are prepared using a combination of chemical vapor infiltration (CVI) and reactive melt infiltration (RMI). The effect of the diamond particle size on the microstructure, mechanical properties, and thermophysical properties of C/SiC‐Diamond composites are investigated. A density of 2.05 g cm −3 is achieved for C/SiC‐Diamond composites impregnated with 1 µm diamond particles. A near twofold enhancement of the thermal conductivity (9-10 W (m K) −1 ) and thermal diffusion coefficient (5 mm 2 s −1 ) is obtained, compared with continuous carbon fiber reinforced silicon carbide (C/SiC) composites (5-6 W (m · K) −1 ) prepared by CVI. It is established that the introduction of diamond can improve the thermal conductivity of C/SiC composites and increase the application potential in rocket engines, aerospace vehicles, and brake materials.
Tech Support
Section titled “Tech Support”Original Source
Section titled “Original Source”References
Section titled “References”- 2001 - Cost Effective Processing of CMC Composites by Melt Infiltration