Characterization of High Thermally Conductive Copper–Diamond Joint Obtained by Using Reactive Multilayers and Solder
At a Glance
Section titled “At a Glance”| Metadata | Details |
|---|---|
| Publication Date | 2019-09-18 |
| Journal | IEEE Transactions on Components Packaging and Manufacturing Technology |
| Authors | Yu Chen, Yupeng Zhang, Yi Jianglong, Yaoyong Yi |
| Institutions | Guangdong Province Welding Technology Institute |
| Citations | 1 |
Abstract
Section titled “Abstract”The temperature evolution during the joining process of high thermally conductive copper-diamond joints was characterized. Experiments and numerical simulations were carried out on the copper-diamond joints, which were joined by using self-propagating reactive multilayers sandwiched by solders. Two different kinds of solders were used, namely Sn-3at%Ag-0.5at%Cu and Sn-9at%Zn. Experimental results showed that the obtained joints had a high shear strength of 32.1 MPa and high thermal conductivity of 38.15 W/(m·K) based upon averages from statistical computations. Numerical simulation results showed that the heat released by the self-propagating reaction of multilayers was quite concentrated. When the reaction finished, the instantaneous temperature of the multilayers had reached nearly 1300 °C. However, the temperature of the copper and diamond never exceeded 400 °C. The heat-affected region of the copper-diamond joint was very localized, and the high-temperature area was mainly distributed within 0.25 mm. There was no significant thermal impact on other nearby components.