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6CCVD Research

Effect of Hot-Pressing Pressure on the Microstructure and Thermal Conductivity of Copper/Ti-Coated Diamond Composites

At a Glance

Section titled “At a Glance”
MetadataDetails
Publication Date2023-12-06
JournalMaterials science forum
AuthorsJing Nan, Rob Torrens, L. Bolzoni, Fei Yang
InstitutionsUniversity of Waikato
Citations1

Abstract

Section titled “Abstract”

Copper/diamond composites show promise as potential thermal management materials for electronic devices due to their excellent thermophysical properties. In this study, copper/55vol%Ti-coated diamond composites were fabricated by hot pressing at 800oC and varying pressures of 300MPa, 400MPa, 500MPa, and 685MPa. The results illustrated that the thermal conductivity of the copper/Ti-coated diamond composites initially increased and then decreased as the pressing pressure increased. Among these hot-pressed composites, the composite hot-pressed at 500MPa exhibits the highest thermal conductivity of 466W/mK. This is attributed to the uniform diamond distribution, highly covered TiC interface on the diamond, and the strong interfacial bonding between the copper and the diamond. Hot pressing is a feasible alternative to fabricate copper/diamond composites with high relative density and high thermal conductivity, the pressing pressure plays a vital role in the microstructure and the final properties of the copper/Ti-coated diamond composites.

Tech Support

Section titled “Tech Support”

Original Source

Section titled “Original Source”

References

Section titled “References”
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  4. **** - The effect of porosity on the thermal conductivity of Al-12wt.% Si/SiC composites [Crossref]
  5. **** - A novel ultrasonic consolidation method for rapid preparation of diamond/Cu composites [Crossref]
  6. **** - Microstructure and thermal conductivity of Cu/diamond composites with Ti-coated diamond particles produced by gas pressure infiltration [Crossref]
  7. 2023 - Effects of alloying elements on diamond/Cu interface properties based on first-principles calculations [Crossref]
  8. **** - Interface manipulation and its effects on the resultant thermal conductivity of hot-forged copper/Ti-coated diamond composites [Crossref]
  9. 2022 - Interfacial Thermal Conductance between Cu and Diamond with Interconnected W−W<sub>2</sub>C Interlayer [Crossref]
  10. **** - Unveiling the interface characteristics and their influence on the heat transfer behavior of hot-forged Cu-Cr/Diamond composites [Crossref]

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