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Three-dimensional topography simulation research of diamond-wire sawing based on MATLAB

At a Glance

Section titled ā€œAt a Glanceā€
MetadataDetails
Publication Date2019-10-12
JournalIndustrial Lubrication and Tribology
AuthorsLigang Zhao, Guofeng Xia, Shi Yu-hu, Aisheng Wu
InstitutionsJiangsu University of Science and Technology
Citations3

Abstract

Section titled ā€œAbstractā€

Purpose The purpose of this paper is to study the influence of the processing parameters of diamond wire sawing on surface morphology and roughness. Design/methodology/approach First, a wire saw cutting model is established to determine the positional relationship between a wire saw and the machined surface of the workpiece, and the abrasive grain cutting trajectory is generated. Through the data processing of the cutting trajectory, the simulation of the three-dimensional surface topography of the slice and the calculation of the surface roughness are realized by using the GUI programming of MATLAB. Finally, different surface roughness values are obtained by changing the machining parameters (saw wire speed and workpiece feed speed). Findings The conclusion is that the surface roughness of the slice is larger when the feed speed is higher and smaller when the linear speed is higher. Originality/value Diamond wire saw cutting is the first process of chip processing, and its efficiency and quality have an important impact on subsequent processing. This paper will focus on the influence of the sawing wire cutting processing parameters (sawing wire speed and workpiece feed speed) on the surface roughness to optimize the processing parameters and obtain smaller surface roughness values. Through MATLAB three-dimensional simulation, the surface morphology can be observed more intuitively, which provides a theoretical basis for improving the processing quality.

Tech Support

Section titled ā€œTech Supportā€

Original Source

Section titled ā€œOriginal Sourceā€

References

Section titled ā€œReferencesā€
  1. 2001 - Wire sawing technology of hard and brittle materials
  2. 2005 - Precision slicing technology for single crystal silicon and relative basic research
  3. 2004 - Fixed abrasive diamond wire saw slicing of Single-Crystal silicon carbide wafers [Crossref]
  4. 2015 - Research progress on cutting technology of SiC mono-crystal wafer with wire saw
  5. 2015 - Monocrystalline silicon surface damage after grinding
  6. 2009 - Design Learning Handbook of MATLAB GUI
  7. 2005 - Study on random vibration of electroplate diamond wire saw subjected to sawing force
  8. 2018 - New Deformation-Induced nanostructure in silicon [Crossref]
  9. 2015 - Changes in surface layer of silicon wafers from diamond scratching [Crossref]

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