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6CCVD Research

Charge carrier trapping by dislocations in single crystal diamond

At a Glance

Section titled “At a Glance”
MetadataDetails
Publication Date2020-03-23
JournalJournal of Applied Physics
AuthorsM. Schreck, Patrik Ơčajev, M. TrĂ€ger, M. Mayr, Theodor GrĂŒnwald
InstitutionsGSI Helmholtz Centre for Heavy Ion Research, University of Augsburg
Citations33

Abstract

Section titled “Abstract”

Charge carrier trapping in diamond crystals containing well-defined concentrations of dislocations was investigated by several complementary techniques. Samples with dislocation densities ndis between <1 × 107 and ≈1 × 109 cm−2 were grown heteroepitaxially on Ir/YSZ/Si(001). In optical pump-probe experiments, ambipolar diffusion coefficients were determined from the decay of light-induced transient free carrier gratings. Modeling their variation with excitation density yielded trapping cross sections σ of 29 and 10 nm for the dislocations and a stress-field-induced reduction in exciton binding energies from 80 to 73 and 60 meV at ndis = 1 × 108 and 1 × 109 cm−2, respectively. The lifetime measured by induced absorption scaled proportional to 1/ndis with absolute values ranging from 0.1 to 10 ns. In the electrical measurements on two sets of detector slices, electron-hole pairs were excited by α-particles and transport was measured separately for electrons and holes. Both types of carriers showed fast transient current signals. The time constant of the additional slow component exclusively seen for holes was in agreement with the activation energy of boron acceptors. Their concentration of ≈0.5 ppb yielded σ = 1.77 × 10−13 cm2 for charged point traps. Schubweg and carrier lifetime due to deep trapping roughly reproduced the 1/ndis trend. For electrons at 3 V/ÎŒm, a value σ = 40 nm was deduced. Cross sections for holes were significantly smaller. Differences in hole trapping between the samples are attributed to charging of dislocations controlled by chemical impurities. Increase in lifetime at high voltages is explained by reduced capture cross sections for hot carriers.

Tech Support

Section titled “Tech Support”

Original Source

Section titled “Original Source”

References

Section titled “References”
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