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Effects of Thermal Boundary Resistance on the Thermal Performance of GaN HEMT on Diamond

MetadataDetails
Publication Date2020-04-01
AuthorsAssaad El Helou, Marko J. Tadjer, Karl D. Hobart, Peter E. Raad
InstitutionsUnited States Naval Research Laboratory, Southern Methodist University
Citations1

GaN high power devices experience substantial self-heating that drives operation temperatures beyond a safe and reliable limit, which has led to the consideration of high conductivity substrates. This study presents a coupled experimental and numerical investigation of the effectiveness of CVD-Diamond as a substrate for GaN HEMTs. The study uses a novel that optimizes a thermal model using an experimentally observed thermal response. The model is then used to assess the effect of the GaN-Di interface on the thermal response of GaN-Di HEMTs, which would serve as a guideline for future developments in GaN and Di growth.

  1. 2007 - A Coupled Thermoreflectance Thermography Experimental System and Ultra-Fast Adaptive Computational Engine for the Complete Thermal Characterization of Three-Dimensional Electronic Devices: Validation