Technological support of crack resistance of silicon carbide plates during diamond-abrasive processing
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2021-04-01 |
| Journal | Vestnik Mashinostroeniya |
| Authors | Bishutin S.G. Alehin S.S. |
| Citations | 2 |
Abstract
Section titled āAbstractāA method is proposed for assigning diamond-abrasive processing modes that provide the required material removal rate and crack resistance of silicon carbide plates, taking into account the stresses arising in the manufacture of a product from the considered ceramic components, in order to reduce scrap in the production of semiconductor devices. Keywords:microcracks, diamond-abrasive processing, silicon carbide plates. [email protected]