Efficient heat dissipation from β-Ga2O3 film directly bonded on diamond substrate
At a Glance
Section titled “At a Glance”| Metadata | Details |
|---|---|
| Publication Date | 2022-05-11 |
| Journal | 2022 International Conference on Electronics Packaging (ICEP) |
| Authors | Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Hitoshi Umezawa, Hideyuki Watanabe |
| Institutions | National Institute of Advanced Industrial Science and Technology |
| Citations | 1 |
Abstract
Section titled “Abstract”A β-Ga <inf xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”>2</inf> O <inf xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”>3</inf> film was directly bonded with a diamond heat spreader for efficient heat dissipation. Ga <inf xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”>2</inf> O <inf xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”>3</inf> is expected as a future material for power electronics, but it has a heat dissipation problem due to its low thermal conductivity. We demonstrated that thermal resistance could be improved by direct bonding with a diamond heat spreader.