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Preparation and thermal conductivity of tungsten coated diamond/copper composites

MetadataDetails
Publication Date2022-09-01
JournalTransactions of Nonferrous Metals Society of China
AuthorsShugang Dai, Jin-wang LI, Chang-ji WANG
InstitutionsNanjing University of Aeronautics and Astronautics, China Shipbuilding Industry Corporation (China)
Citations28

Tungsten was plated on the surface of diamond by using thermal diffusion method. Different process parameters were employed to prepare the composites with tungsten, diamond and copper. The micro morphology of different samples was observed, and the thermal conductivity of samples was measured by laser flash method. The optimal process parameters for preparing diamond/copper composites with high thermal conductivity were investigated. The results indicated that plating tungsten on diamond could modify the interface bonding. When the diamond was plated for 60 min, the coating appeared intact, uniform and flat, and the thermal conductivity of the sample could reach as high as 486 W/(mĀ·K). The integrity and uniformity were more important than thickness for the coating. When the tungsten-plated diamond was further annealed, the metallurgical bonding between the coating and the diamond was enhanced, and the thermal conductivity rose to 559 W/(mĀ·K).

  1. 2018 - Macroporous diamond foam: A novel design of 3D interconnected heat conduction network for thermal management [J] [Crossref]
  2. 2009 - Application of active element to Cu/diamond composites [J]
  3. 2014 - Properties and microstructure of Cu/diamond composites prepared by spark plasma sintering method [J] [Crossref]
  4. 2021 - Corrosion performance and tribological behavior of diamond-like carbon based coating applied on Ni-Al-bronze alloy [J] [Crossref]
  5. 2013 - Research status and prospect of CD/Cu composite for electronic packaging material [J]
  6. 2019 - Research progress on preparation methods of high thermal conductivity diamond/copper composites [J]
  7. 2020 - Effect of diamond surface treatment on microstructure and thermal conductivity of diamond/W-30Cu composites prepared by microwave sintering [J] [Crossref]
  8. 2020 - The role of Cr interlayer in determining interfacial thermal conductance between Cu and diamond [J] [Crossref]
  9. 2018 - Research progress on interfacial modification of diamond/copper composites with high thermal conductivity [J]
  10. 2020 - Research progress of diamond/copper composites with high thermal conductivity [J] [Crossref]