Effect of ND on Thermodynamic Performance of SiO2/Epoxy Composite Insulation Materials
At a Glance
Section titled “At a Glance”| Metadata | Details |
|---|---|
| Publication Date | 2022-11-18 |
| Authors | Hao Zhang, Wenxue Zhang, Qing Chen, Dong Huang, Qiang Li |
| Institutions | Hefei University of Technology |
| Citations | 1 |
Abstract
Section titled “Abstract”The development direction of high power density and compactness of power equipment puts forward higher requirements for the performance of epoxy insulation materials under high temperature environment. The doping of micron SiO <inf xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”>2</inf> effectively improves the thermal conductivity of epoxy composites, but reduces the heat resistance and mechanical performance. This study proposes a method to improve the thermomechanical performance of SiO <inf xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”>2</inf> /epoxy composites with nano diamond (ND). The results showed that the inhibitory effect of ND on SiO <inf xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”>2</inf> agglomeration and its excellent intrinsic thermal conductivity and hardness successfully increased the $\mathrm{T}_{\mathrm{g}}$, thermal conductivity and bending strength of SiO <inf xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”>2</inf> /epoxy composites by 9.94%, 5.59% and 9.94%, respectively, when the addition of ND was 6wt%. The addition of ND brings further improvement to the thermodynamic performance of SiO <inf xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”>2</inf> / epoxy composites. This study provides a feasible method for improving the thermodynamic performance of epoxy composite insulation materials.
Tech Support
Section titled “Tech Support”Original Source
Section titled “Original Source”References
Section titled “References”- 2020 - Preparation and thermal conductivity of diamond particle/resin matrix composites