Bulletin Board - A Successful IWIPP 2022 in Grenoble, France

At a Glance

Metadata	Details
Publication Date	2022-12-27
Journal	IEEE Electrical Insulation Magazine
Authors
Analysis	Full AI Review Included

Executive Summary

The International Workshop on Integrated Power Packaging (IWIPP 2022) focused on state-of-the-art advancements necessary for next-generation power sources, emphasizing integration and wide bandgap technology.

Core Focus: Integration of circuits, materials, and manufacturing processes to create high-performance power sources.
Hottest Topic: Developing new packaging concepts to meet the demand for high voltage (HV) power sources with low parasitics, utilizing wide bandgap (WBG) semiconductors (e.g., diamond, SiC).
Key Challenges Addressed: Insulation materials and systems for power electronic modules, electric field grading in HV integrated systems, and managing thermal, EMI, and reliability issues.
Modeling Importance: Significant discussion centered on systematic approaches to modeling and simulation, particularly for conducted EMI in power electronics systems.
Industry Insight: Presentations provided fundamental understanding of device design (e.g., layout of power semiconductor chips) appreciated by non-semiconductor experts.
Format & Scope: A hybrid event (50 in-person, 24 virtual) representing 15 countries from industry, academia, and government sectors.

Technical Specifications

Since the source material is a conference report and not a research paper, the technical specifications extracted relate primarily to the event structure and scope, which define the context of the research discussed.

Parameter	Value	Unit	Context
Event Date Range	August 24 to 26, 2022	Days	IWIPP 2022 Workshop
In-Person Attendance	50	Attendees	Hybrid workshop format
Virtual Attendance	24	Attendees	Hybrid workshop format
Total Presentations	35	Presentations	Including keynotes and invited/submitted papers
Keynote Presentations	6	Presentations	Focused on core technical themes
Poster Presentations	9	Posters	Supplementing the main sessions
Represented Countries	15	Countries	Origin of attendees and contributors
Next Event Cycle	2	Years	IWIPP is held biennially
Next Event Announcement	2023	Year	Announcement for the 2024 edition

Key Technical Themes and Challenges

The workshop focused on uniting progress across several critical engineering disciplines to advance power electronics technology.

Wide Bandgap (WBG) Integration:
- Focus on using WBG semiconductors (including diamond semiconductor) to reduce size and increase efficiency in power sources.
- Requirement for new packaging concepts to handle high voltage/power while maintaining low parasitic inductance.
Insulation and Dielectrics:
- Addressing insulation material challenges necessary for creating high voltage/current power modules.
- Specific research presented on “Electric Field Grading in HV Integrated Systems.”
Modeling and Simulation:
- Systematic approaches for “Modeling and Simulation of Conducted EMI in Power Electronics Systems.”
- Using modeling and testing to optimize isolation materials and packaging design.
Manufacturing and Layout:
- Focus on the practical applications of materials, components, manufacturing, and qualification of power sources.
- Insights into the optimal layout of power semiconductor chips (e.g., from Infineon Technologies).
Reliability and Thermal Management:
- Dedicated sessions covering manufacturing processes, thermal performance, EMI mitigation, and overall reliability of power modules.

Commercial Applications

The technologies discussed at IWIPP 2022 are foundational for high-growth sectors requiring efficient, compact, and reliable power conversion and management.

Industry Sector	Application Focus	Technical Relevance
Electric Vehicles (EVs)	High-power density inverters and charging systems.	Demand for high voltage, low-parasitic packaging using WBG devices (SiC/GaN).
Renewable Energy	Grid-scale power conversion and storage systems.	Need for reliable, high-efficiency power modules and advanced thermal management.
Industrial Power	Motor drives, industrial controls, and high-frequency power supplies.	Focus on EMI mitigation, reliability, and robust insulation systems for harsh environments.
Aerospace & Defense	Compact, high-power systems requiring extreme reliability.	Utilization of diamond semiconductors and advanced dielectrics for high-temperature operation.
Semiconductor Fabrication	Optimization of WBG device layout and integration into complex modules.	Insights into chip design and manufacturing processes for next-generation power devices.

View Original Abstract

workshop was sponsored by the following IEEE societies: the Dielectrics and Electrical Insulation Society (DEIS), the Power Electronics Society (PELS), and the Electronics Packaging Society (EPS), and by the Power Source and Manufacturing Association (PSMA).There were four partners or exhibitors (Nanowired, Pink, PVATepla, and Wolfspeed) that also contributed to the success of the event.The workshop was chaired by Francesco Iannuzzo in collaboration with Technical Chair Nick Baker.The workshop focused on the integration of circuits, materials, and manufacturing to create state-of-the-art power sources.The sessions were organized to provide technology updates for design, packaging, and manufacturing engineers and all engaged in research and the practical applications of materials, components, manufacturing, and qualification of power sources.In addition to the excellent sessions on power modules, manufacturing processes, thermal, EMI, and reliability, we had exciting presentations on diamond semiconductor and dielectrics and insulation.IWIPP 2022 was a hybrid workshop with 50 in-person and 24 virtual attendees.The attendees and contributors represented 15 countries and came from industry, academia, and govern-

Tech Support

Original Source

DOI: https://doi.org/10.1109/mei.2023.9999526