Optimization of brazing process and structure lightweight design for diamond microchannel
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2023-06-01 |
| Journal | Journal of Physics Conference Series |
| Authors | Kun Fang, Xuesong Liu, Tiesong Lin, Haitao Jiang |
| Institutions | Hefei University of Technology, Harbin Institute of Technology |
| Citations | 1 |
Abstract
Section titled āAbstractāAbstract The application of diamond material significantly improves the heat dissipation capability of liquid cooling microchannels, solving the bottleneck problem of heat dissipation for highly integrated electronic components and thus promoting the development of a new generation of military electronic equipment. In this study, diamond microchannels with ultra-high heat flux density were reliably vacuum-brazed by using AgCuTi filler metal in a high vacuum furnace. Microstructure and properties of diamond brazing joints were studied and effect of brazing temperature and time was analyzed. The optimal brazing process parameters were obtained as follows: a vacuum level of <1Ć10 ā5 Pa, brazing temperature of 840Ā°C, brazing pressure of 0.5-3 bars and holding time of 10 min. Following vacuum-brazing experiment, the brazing residual stress and working stress of the diamond microchannel were analyzed by finite element simulation. The wall thickness of the diamond microchannel was optimized. The minimum wall thickness, which was 0.4 mm, was obtained for the diamond microchannel with dimensions of 14 mm Ć 10 mm Ć 1.3 mm. On that basis, the influence of brazing pressure on the brazing filler overflow in the diamond microchannel brazing process was studied. It was showed that when the pressure was below 1 bar, the overflow of brazing filler from the brazing seam could be controlled to a minimum, especially suitable for brazing precision. The formation of residues in the diamond microchannel was thereby avoided basically, and a diamond microchannel heat sink with good performance was obtained.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
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