The effect of tool wear on the damaged layer thickness and tool wear rate in ultra-precision turning of quartz glass
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2023-07-26 |
| Journal | Journal of Micromechanics and Microengineering |
| Authors | Yujie Liu, Hao Tong, Yong Li, Jialong Chen |
| Institutions | Tsinghua University |
| Citations | 4 |
Abstract
Section titled āAbstractāAbstract Quartz glasses have been extensively used for many fields, such as semiconductor technology, optical instruments, inertial navigation and others. Ultra-precision turning with diamond tools can achieve high surface accuracy when processing non-ferrous materials. In recent years, ultra-precision turning has also been tried to be applied to process brittle materials, but there are constraints including small removal amount and tool wear. When diamond tools are used to cut quartz glass, tool wear occurs under the combined action of thermal effect and mechanical friction, which will affect the damaged layer thickness of the processed quartz glass. In this paper, the tool wear factor is led into the calculation of the extrusion volume, and the damaged layer thickness is calculated by the extrusion volume. Combined with the results of quartz glass turning experiments and the calculated results by simulation, the effect of tool wear factor on the damaged layer thickness and the tool wear rate is analyzed. The analysis shows that tool wear will lead to chip fracture thickness decrease and extrusion volume increase. Combined action of these two aspects, the damage layer thickness keeps unchanged at first and then rises with the increase of tool wear. In addition, the experimental results show that the tool wear rate rises with the increase of tool wear.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- 2023 - RF glass technology is going mainstream: review and future applications [Crossref]
- 2021 - Measurement and analysis of through glass via noise coupling and shielding structures in a glass interposer [Crossref]
- 2020 - One-step femtosecond laser stealth dicing of quartz [Crossref]
- 2019 - Fabrication of multiple through-holes in non-conductive materials by electrochemical discharge machining for RF MEMS packaging [Crossref]
- 2008 - Deep plasma etching of glass for fluidic devices with different mask materials [Crossref]
- 2022 - Formation of macro-sized through-holes in glass using notch-shaped tubular electrodes in electrochemical discharge machining [Crossref]
- 2020 - A multi-strain-rate damage model on fracture prediction in single-point diamond turning process [Crossref]
- 2015 - Microtexture generation using controlled chatter machining in ultraprecision diamond turning [Crossref]
- 2021 - Influence mechanism of silicon surface generation in ultraprecision turning [Crossref]
- 2020 - Study on new method and mechanism of microcutting-etching of microlens array on 6H-SiC mold by combining single point diamond turning with ion beam etching [Crossref]