Cryogenic flip-chip interconnection for silicon qubit devices
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2024-02-08 |
| Journal | Japanese Journal of Applied Physics |
| Authors | Tokio Futaya, Raisei Mizokuchi, Misato Taguchi, Takuji Miki, Makoto Nagata |
| Institutions | Kobe University, Tokyo Institute of Technology |
| Citations | 5 |
Abstract
Section titled āAbstractāAbstract Interfacing qubits with peripheral control circuitry poses one of the major common challenges toward realization of large-scale quantum computation. Spin qubits in silicon quantum dots (QDs)are particularly promising for scaling up, owing to the potential benefits from the know-how of the semiconductor industry. In this paper, we focus on the interposer technique as one of the potential solutions for the quantum-classical interface problem and report DC and RF characterization of a silicon QD device mounted on an interposer. We demonstrate flip-chip interconnection with the qubit device down to 4.2 K by observing Coulomb diamonds. We furthermore propose and demonstrate a laser-cut technique to disconnect peripheral circuits no longer in need. These results may pave the way toward system-on-a-chip quantum-classical integration for future quantum processors.