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Modelling of the microstructure and thermal conductivity of SiC-bonded diamond materials

MetadataDetails
Publication Date2024-04-12
JournalOpen Ceramics
AuthorsJakob Schƶne, W. Beckert, Bjƶrn Matthey, Mathias Herrmann
InstitutionsFraunhofer Institute for Ceramic Technologies and Systems
Citations6

Materials with high thermal conductivity are required in a wide range of thermal management applications. Silicon carbide (SiC) bonded diamond materials, which can be produced without pressure, are a possible candidate for such applications. They exhibit thermal conductivities >650 W/(mĀ·K) depending on the diamond content, diamond grain size and residual silicon content. It is difficult to experimentally determine the influence of these factors on the thermal conductivity separately, as changing one of these parameters affects the other parameters. Therefore, a method for generating digital microstructures of SiC- bonded diamond materials was developed and the thermal conductivity was calculated as a function of the grain size These data were compared with real structures.

  1. 2001 - Low-pressure fabrication of diamond-SiC-Si composites [Crossref]
  2. 2005 - The development of a diamond silicon carbide composite material
  3. 2018 - Silicon-carbide-Bonded diamond components for harsh environments -Cost-Effective components with outstanding properties
  4. 2009 - Thermal conductivity of diamond composites//thermal conductivity of diamond composites [Crossref]
  5. 2021 - ā€žReaction-Diffusion mechanism of synthesis in the diamond-silicon carbide system [Crossref]
  6. 2017 - SiC-bonded diamond materials produced by pressureless silicon infiltration [Crossref]
  7. 2014 - Microstructure and properties of diamond/SiC composites prepared by tape-casting and chemical vapor infiltration process [Crossref]
  8. 2013 - Fabrication of diamond/SiC composites by Si-vapor vacuum reactive infiltration [Crossref]
  9. 2021 - Thermal transport characteristics in diamond/SiC composites via molten Si infiltration [Crossref]