Synergistic Enhancement of Thermal Conductivity Through Nano Diamond Coordinated Boron Nitride
At a Glance
Section titled “At a Glance”| Metadata | Details |
|---|---|
| Publication Date | 2024-04-22 |
| Journal | IEEE Transactions on Plasma Science |
| Authors | Lu Wu, Guozhi Jia, Chao Wang, Yanling Liu, Yang Li |
| Institutions | Tianjin Chengjian University |
| Citations | 4 |
Abstract
Section titled “Abstract”The characteristics of films possessing both outstanding flexibility and thermal conductivity are key for flexible integrated microelectronic devices. The main issue is how to integrate diamond into thin films to improve thermal conductivity. The boron nitride-nano diamond/polyurethane (BN-ND/PU) composites are prepared through a novel surface modification-assisted electrostatic bonding technique. A notable temperature reduction between the heat source and the film’s surface by integrating a 33% BN-ND into the PU matrix. A large resistance of the BN-ND/PU complexes is 57.1 M <inline-formula xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”> <tex-math notation=“LaTeX”>$\cdot\Omega$</tex-math> </inline-formula> at 75 <inline-formula xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”> <tex-math notation=“LaTeX”>$^{\circ}$</tex-math> </inline-formula> C, preserving its excellent insulation properties. The CPU core temperature is observed to be 2 <inline-formula xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”> <tex-math notation=“LaTeX”>$^{\circ}$</tex-math> </inline-formula> C-3 <inline-formula xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”> <tex-math notation=“LaTeX”>$^{\circ}$</tex-math> </inline-formula> C cooler than that obtained using commercial silicone grease in personal computer. The thermal conductivity of the silicone grease is measured to be 2.537 W/(m <inline-formula xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”> <tex-math notation=“LaTeX”>$\cdot$</tex-math> </inline-formula> K) by the steady-state heat flow method. The mechanism can be ascribed to the role of interface diffusion within the BN-ND composites.