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Van der Waals β-Ga2O3 thin films on polycrystalline diamond substrates

MetadataDetails
Publication Date2025-08-31
JournalNature Communications
AuthorsJing Ning, Zhichun Yang, Haidi Wu, X.-Y. Dong, Yaning Zhang
InstitutionsXidian University
Citations1
AnalysisFull AI Review Included

This study successfully demonstrates the epitaxial growth of highly oriented, single-crystalline Van der Waals beta-Gallium Oxide (VdW-β-Ga2O3) thin films on high-thermal-conductivity polycrystalline diamond substrates, overcoming major thermal management bottlenecks for next-generation power electronics.

  • Thermal Breakthrough: The use of a Graphene (2D material) interlayer enables VdW epitaxy, resulting in an ultralow Thermal Boundary Resistance (TBReff) of 2.82 m2K/GW. This value is one order of magnitude lower than previous bonding or interlayer approaches, fulfilling thermal requirements for kW-class power devices.
  • High Crystallinity: The 350 nm thick VdW-β-Ga2O3 films achieved exceptional crystal quality, exhibiting a minimum rocking curve Full Width at Half Maximum (FWHM) of 0.18° for the (201) orientation.
  • Scalable Growth Method: The films were grown using non-vacuum, cost-effective Mist Chemical Vapor Deposition (Mist-CVD), which is suitable for large-area deposition and uses affordable, safe precursors.
  • Lattice Mismatch Mitigation: Computational modeling confirmed that the Graphene interlayer significantly enhances adsorption energy and reduces the lattice mismatch coefficient between β-Ga2O3 (201) and Graphene to a structurally stable 4.9%.
  • High-Performance Device: Photodetectors fabricated using the VdW-β-Ga2O3 film demonstrated superior performance metrics, including a Photo-to-Dark Current Ratio (PDCR) of 106 and a high responsivity of 210 A/W.
  • Stress Management: In-situ Raman measurements confirmed that the Graphene interlayer effectively alleviates interfacial thermal expansion stress between the Ga2O3 film and the diamond substrate.
ParameterValueUnitContext
Thermal Boundary Resistance (TBReff)2.82m2K/GWβ-Ga2O3/Diamond interface (Sample 2, bare diamond)
Thermal Conductivity (TC)7.19W/mK350 nm thick VdW-β-Ga2O3 film
Rocking Curve FWHM (201)0.18°Smallest value achieved at 760 °C growth temperature
RMS Roughness6.71nm350 nm thick film, grown at 760 °C
Film Thickness350nmOptimized thickness for minimum FWHM
Lattice Mismatch (β-Ga2O3 [201] vs Graphene)4.9%Calculated coefficient, ensuring structural stability (threshold is 6%)
Photo-to-Dark Current Ratio (PDCR)106N/AFabricated photodetector performance
Responsivity (R)210A/WFabricated photodetector performance
Rise Time (t1)54msPhotodetector response time
Decay Time (t2)4msPhotodetector response time
Diamond Substrate TC (300 K)greater than 1800W/mKPolycrystalline diamond (Element Six TM180) specification
Oxygen Vacancy Density15.1%Lowest ratio (OII/(OI + OII)) achieved at 1000 sccm O2 flow

The VdW-β-Ga2O3 films were grown using Mist Chemical Vapor Deposition (Mist-CVD) on polycrystalline diamond substrates pre-treated with a Graphene interlayer.

  1. Graphene Preparation and Transfer:

    • Monolayer Graphene (ML) was grown on 25-µm-thick Alfa Aesar copper foil via CVD (40 sccm CH4, 40 sccm H2, followed by 10 sccm CH4, 20 sccm H2).
    • The ML Graphene was transferred onto Element Six TM180 polycrystalline diamond substrates using a Methyl Methacrylate (MMA) support layer and ammonium persulfate etching.
    • The diamond substrate was cleaned with acetone, alcohol, deionized water, and dilute HF solution to ensure an atomically clean interface prior to transfer.
  2. Mist-CVD Epitaxial Growth (Optimized Recipe):

    • Precursor: Gallium acetylacetonate (C15H21O6Ga) dissolved in deionized water and concentrated hydrochloric acid (HCl).
    • Substrate Temperature: Optimized at 760 °C (range 700-800 °C) under an Argon (Ar) atmosphere.
    • Atomization: An ultrasonic nebulizer (1.7 MHz) converted the precursor solution into small droplets.
    • Carrier Gas (O2): Optimized flow rate of 600 sccm (range 300-1000 sccm) to control oxygen partial pressure and minimize oxygen vacancies.
    • Diluting Gas (Ar): Flow rate maintained at 3000 sccm.
    • Growth Duration: 30-40 minutes.
  3. Characterization Techniques:

    • Atomic Structure: Transmission Electron Microscopy (TEM) and High-Resolution TEM (HR-TEM) confirmed the VdW interface and crystal orientations ((201) predominant).
    • Crystallinity: X-ray Diffraction (XRD) and rocking curve measurements determined crystal orientation and FWHM.
    • Surface Morphology: Atomic Force Microscopy (AFM) and Scanning Electron Microscopy (SEM) measured RMS roughness and grain coalescence.
    • Stress and Thermal Properties: In-situ temperature-dependent Raman spectroscopy measured thermal expansion stress release. Time-Domain Thermoreflectance (TDTR) measured thermal conductivity and TBReff.

The successful integration of high-crystallinity β-Ga2O3 with diamond via VdW epitaxy and Mist-CVD addresses critical thermal limitations, enabling the development of next-generation devices in several high-power and high-frequency sectors.

  • High-Power Electronics:

    • Ultra-High Voltage MOSFETs and Schottky Diodes (β-Ga2O3 has a Baliga’s Figure of Merit 4 times better than GaN).
    • kW-class power devices requiring superior thermal management to prevent performance degradation due to self-heating effects.
    • High-efficiency power converters and inverters for electric vehicles and smart grids.
  • Ultraviolet (UV) Optoelectronics:

    • Solar-blind photodetectors (PDs) utilizing the high PDCR (106) and responsivity (210 A/W) of the VdW-β-Ga2O3 films.
    • UV sensors for flame detection, space communication, and environmental monitoring.
  • Advanced Substrate Technology:

    • Development of wafer-scale Ga2O3/Diamond composite substrates for thermal dissipation in high-density electronic packaging.
    • Heterogeneous integration platforms where lattice mismatch is traditionally prohibitive.