Quantum Biosensors on Chip - A Review from Electronic and Photonic Integrated Circuits to Future Integrated Quantum Photonic Circuits
At a Glance
Section titled âAt a Glanceâ| Metadata | Details |
|---|---|
| Publication Date | 2025-10-22 |
| Journal | Microelectronics |
| Authors | Yasaman Torabi, Shahram Shirani, James P. Reilly |
| Institutions | Bell (Canada), McMaster University |
| Citations | 1 |
| Analysis | Full AI Review Included |
Executive Summary
Section titled âExecutive SummaryâThis review outlines the technological roadmap from classical Electronic Integrated Circuits (EICs) and Photonic Integrated Circuits (PICs) toward next-generation Integrated Quantum Photonic (IQP) biosensors, emphasizing scalability and high sensitivity.
- Core Value Proposition: Quantum biosensors (QDs, NV centers) surpass the Standard Quantum Limit (SQL) by leveraging quantum phenomena (coherence, entanglement), achieving sensitivity approaching the Heisenberg Limit (1/N scaling).
- Performance Benchmarks: NV center biosensors demonstrate the highest sensitivity, reaching limits of detection (LOD) as low as ~1 aM-fM, enabling single-molecule detection at room temperature.
- Integration Trajectory: The pathway involves migrating from noise-susceptible EICs (SNR 15-30 dB) and complex PICs (SNR 30-50 dB) to IQP systems that combine quantum emitters, photonic waveguides, and CMOS-compatible detectors.
- Key Quantum Platforms: NV centers in diamond offer room-temperature operation and high magnetic sensitivity (1 nT/âHz). Quantum Dots (QDs) provide superior multiplexing capability via size-tunable, spectrally distinct emission.
- IQP Components Demonstrated: Recent breakthroughs include the integration of quantum light sources, low-loss MEMS-based phase shifters (<0.5 dB loss, VÏ = 2 V), and CMOS-compatible single-photon avalanche diodes (SPADs) on silicon platforms.
- Future Direction: Full IQP integration requires hybrid material platforms (SiC, LiNbO3) for enhanced quantum coherence and 3D vertical stacking (TSV) to achieve mass-producible, portable diagnostic devices.
Technical Specifications
Section titled âTechnical Specificationsâ| Parameter | Value | Unit | Context |
|---|---|---|---|
| Quantum Limit Scaling | 1/âN | N/A | Standard Quantum Limit (SQL) |
| Quantum Limit Scaling | 1/N | N/A | Heisenberg Limit (HL) |
| NV Center LOD | ~1 aM-fM | M | Highest sensitivity quantum biosensing |
| Plasmonic Sensor LOD | ~1 fM-pM | M | Quantum tunneling detection |
| QD Sensor LOD | ~1 pM-nM | M | Fluorescence-based detection |
| NV Magnetometer Sensitivity | 1 | nT/âHz | High-sensitivity magnetic field detection |
| Spin-Enhanced NV LOD | 8.2 x 10-19 | M | HIV-1 RNA detection |
| Plasmonic Gap Distance (S) | 0.5-2.8 | nm | Quantum tunneling regime |
| DNA Conductivity (Ï0) | 7.8 | S/m | For gaps S < 3 nm |
| EIC Signal-to-Noise Ratio (SNR) | 15-30 | dB | Typical EIC biosensor performance |
| PIC Signal-to-Noise Ratio (SNR) | 30-50 | dB | Typical PIC biosensor performance |
| EIC Footprint | ~0.01-10 | mm2 | Compact electronic integration |
| PIC Footprint | ~1-100 | mm2 | Photonic integration |
| Bio-Impedance IC Power | <10 | ”W | Low-power CMOS circuit |
| Capacitive CMOS Resolution | 4.5 | fF | Cancer biomarker detection |
| CMOS Picoamp Readout Noise | 7.2 | pA_rms | Low-noise electrochemical array readout |
| Si3N4 MZI Sensitivity | 6.8 x 10-6 | RIU | Refractive Index Unit sensitivity |
| Slotted Plasmonic Ring Sensitivity | 1609 | nm/RIU | Enhanced sensitivity via 10 nm slot width |
| Subwavelength Micro-ring Q-factor | ~30,000 | N/A | SARS-CoV-2 detection |
| MEMS Phase Shifter Loss | <0.5 | dB | Low-loss IQP component |
| MEMS Phase Shifter VÏ | 2 | V | Low voltage control |
| Ge-Si SPAD Array Size | 32 x 32 | pixels | CMOS-compatible single-photon detection |
| Ge-Si SPAD Detection Probability | Up to 12 | % | At 1310 nm, room temperature |
| NbN SNSPD Efficiency | 91.6 | % | Operating at 1.5 K (cryogenic) |
Key Methodologies
Section titled âKey MethodologiesâThe integration of quantum biosensing relies on reconciling the operational differences between quantum systems (coherence, low-temperature) and classical electronics (deterministic, ambient temperature).
-
Quantum State Initialization and Readout:
- NV Centers: Electron spin states are initialized using green laser excitation and manipulated using microwave radiation. Readout is achieved by detecting spin-dependent fluorescence, which shifts based on local magnetic or chemical changes.
- Quantum Dots: Detection relies on size-tunable fluorescence emission. Target molecule binding alters the QDâs fluorescence properties, providing an optical signal.
-
Plasmonic Quantum Tunneling:
- Molecular binding events are detected by monitoring changes in electron tunneling current between closely spaced metal nanoparticles (e.g., gold). The current decreases exponentially with the nanogap distance, providing ultra-high sensitivity to minute molecular interactions.
-
Electronic Integrated Circuit (EIC) Integration:
- CMOS technology is used to transduce biochemical interactions (impedance, capacitance, current changes) into measurable electrical signals directly on-chip.
- MEMS structures (cantilevers, resonators) are integrated with EICs to enhance sensitivity by detecting mass or stress changes induced by biomolecular binding.
-
Photonic Integrated Circuit (PIC) Integration:
- Waveguide-based sensors (Mach-Zehnder Interferometers, Ring Resonators) exploit the evanescent field extending from the waveguide surface. Biomolecular binding alters the local refractive index (RIU), causing a measurable shift in optical phase or resonance wavelength.
- PICs utilize high refractive index contrast materials (Silicon, Si3N4) compatible with CMOS fabrication for high-speed, low-power operation.
-
Integrated Quantum Photonic (IQP) Architecture:
- Hybrid Material Platforms: Utilizing materials like Silicon Carbide (SiC) or Lithium Niobate (LiNbO3) alongside silicon photonics to improve nonlinear optical properties and maintain room-temperature quantum coherence.
- On-Chip Components: Integrating quantum light sources (generating single or entangled photons), low-loss phase shifters (for quantum gate implementation), and single-photon detectors (SPADs/SNSPDs) onto a single silicon chip.
- 3D Integration: Future IQP manufacturing aims for vertical stacking of quantum, photonic, and electronic layers using Through-Silicon-Via (TSV) techniques to maximize density and scalability.
Commercial Applications
Section titled âCommercial ApplicationsâThe convergence of quantum sensing and integrated circuit technology is poised to revolutionize several high-value sectors:
| Sector | Technology Focus | Application Examples |
|---|---|---|
| Clinical Diagnostics | NV/QD Biosensors, PICs | Early detection of cancer biomarkers (fM sensitivity), viral detection (SARS-CoV-2 RNA), and respiratory antibody profiling. |
| Personalized Healthcare | EIC/CMOS Sensors | Wearable cardiovascular monitoring (bio-impedance ICs), real-time glucose sensing, and monitoring of oxidative stress in living cells (NV relaxometry). |
| Drug Discovery & Genomics | Quantum Computing, QDs | Accelerated molecular structure search, protein folding simulation, high-throughput DNA sequencing, and detection of antibiotic resistance. |
| Quantum Metrology | NV Magnetometers | Quantum-enhanced magnetoencephalography (MEG) for non-invasive brain activity monitoring, surpassing classical noise limits. |
| Environmental Monitoring | PIC Biosensors | Highly sensitive detection of water pollutants and toxins using rib-waveguide MZIs and slotted plasmonic ring resonators. |
| Quantum Hardware | IQP Systems | Development of compact, scalable quantum processors and communication systems utilizing integrated single-photon sources and detectors (SPADs, SNSPDs). |
View Original Abstract
Quantum biosensors offer a promising route to overcome the sensitivity and specificity limitations of conventional biosensing technologies. Their ability to detect biochemical signals at extremely low concentrations makes them strong candidates for next-generation sensing systems. This paper reviews the current state of quantum biosensors and discusses their future implementation in chip-scale platforms that combine microelectronic and photonic technologies. It covers key quantum biosensing approaches including quantum dots (QDs), and nitrogen-vacancy (NV) centers. This paper also considers their potential compatibility with electronic integrated circuits (EICs), photonic integrated circuits (PICs) and integrated quantum photonic (IQP) systems for future biosensing applications. To our knowledge, this is the first review to systematically connect quantum biosensing technologies with the development of microelectronic and photonic chip-based devices. The goal is to clarify the technological trajectory toward compact, scalable, and high-performance quantum biosensing systems.
Tech Support
Section titled âTech SupportâOriginal Source
Section titled âOriginal SourceâReferences
Section titled âReferencesâ- 2025 - Advancements In Biosensor Technologies: From Nanobiosensors To Biocompatible And Optical Systems For Clinical And Environmental Applications
- 2022 - Recent Progress in Chemometrics Driven Biosensors for Food Application [Crossref]
- 2020 - A 0.5-V Sub-10-ÎŒW 15.28-mΩ/âHz Bio-Impedance Sensor IC With Sub-1° Phase Error [Crossref]
- 2016 - A Glucose Biosensor Using CMOS Potentiostat and Vertically Aligned Carbon Nanofibers [Crossref]
- 2003 - An Integrated Optical Interferometric Nanodevice Based on Silicon Technology for Biosensor Applications [Crossref]
- 2023 - A Point-of-Care Biosensor for Rapid Detection and Differentiation of COVID-19 Virus (SARS-CoV-2) and Influenza Virus Using Subwavelength Grating Micro-Ring Resonator [Crossref]
- 2024 - A Multiplex âDisposable Photonicsâ Biosensor Platform and Its Application to Antibody Profiling in Upper Respiratory Disease [Crossref]