Development of a New Type Saw Wire Fixed Diamond Abrasive Grains with Solder and Ni Electroplating and Its Application to Slicing of Silicon and Sapphire Ingots
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2015-01-01 |
| Journal | Journal of the Japan Society of Powder and Powder Metallurgy |
| Authors | Atsushi Nakahira, Atsushi OKIMURA, Yasuhito HAGIWARA, Takashi NAKANISHI, Masaru Yokota |
| Institutions | The Nakamura Hajime Eastern Institute, Osaka Prefecture University |
| Citations | 1 |
Abstract
Section titled āAbstractāWe have carried out research and development of high-performance diamond abrasive grains fixed saw wire for electronic equipment material for wafer fabrication, such as solar cells for silicon and sapphire for the LED package substrate. It advances the prototype of the saw wire, to produce a product in a way that makes a commercial basis. Through these research and development activities, we report on the process that led to the production of silicon wafers for solar cells and sapphire wafers for LED package substrate using novel saw wires fixed diamond abrasive rains with solder and Ni electroplating process.