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3 µm thick GaSb membrane diodes integrated with CVD diamond heat spreaders for thermally managed TPV cells

MetadataDetails
Publication Date2015-06-01
AuthorsEmma J. Renteria, Sadhvikas Addamane, Darryl Shima, C.P. Hains, Ganesh Balakrishnan
InstitutionsUniversity of New Mexico
Citations2

We demonstrate the integration of 3μm thick GaSb PN junctions with CVD diamond heat spreaders. The GaSb diodes are grown metamorphically on a GaAs substrate, bonded to CVD diamond by a solder process and isolated from the GaAs substrate by wet etching. Electrical characterization shows good diode behavior with a turn on voltage of 0.5 V and a reverse-bias leakage current of 1.12 mA.

  1. 1998 - CVD diamond: a new engineering material for thermal, dielectric and optical applications