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6CCVD Research

Heat dissipation improvement with diamond heat spreader on hybrid Si micro-cooler for GaN devices

At a Glance

Section titled ā€œAt a Glanceā€
MetadataDetails
Publication Date2015-06-01
AuthorsYong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang
InstitutionsSingapore Science Park, Agency for Science, Technology and Research
Citations5

Abstract

Section titled ā€œAbstractā€

A diamond heat spreader of small size has been directly attached between the chip and the hybrid Si micro-cooler for thermal performance improvement of the GaN-on-Si device. In the fabricated test vehicle, one hotspot of size 450Ɨ300Ī¼m <sup xmlns:mml=ā€œhttp://www.w3.org/1998/Math/MathMLā€ xmlns:xlink=ā€œhttp://www.w3.org/1999/xlinkā€&gt;2&lt;/sup> is used to mimic the heating area of one GaN unit. The microwave CVD diamond of high thermal conductivity was bonded through TCB process. With the diamond heat spreader attached on the reduced by 25.7% and 26.1%, respectively. Two types of diamond heat spreader of different thermal conductivities are tested and compared. High improvement of heat dissipation capability has been demonstrated.

Tech Support

Section titled ā€œTech Supportā€

Original Source

Section titled ā€œOriginal Sourceā€

References

Section titled ā€œReferencesā€
  1. 2008 - Single-phase Hybrid Micro-channel/Microjet Impingement Cooling
  2. 2007 - Performance-Cost Optimization of a Diamond Heat Spreader

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