Impact of poly-crystalline diamond within power semiconductor device modules in a converter
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2016-09-01 |
| Authors | M. Sweet, E.M. Sankara Narayanan, Kalyani Menon |
| Institutions | University of Sheffield |
| Citations | 1 |
Abstract
Section titled āAbstractāThis paper presents the finding of thermal characterization of polycrystalline diamond for power semiconductor device modules in a converter. Comparisons of measured thermal performance of two diamond demonstrators, consisting of metalized diamond tiles attached to aluminum and copper forced air cooled heat sinks; show that power dissipation can be increased from 278W to 535W when compared to commercial products operating at a case temperature of 100Ā°C and a maximum junction temperature of 175Ā°C. Detailed converter simulations of a two level three-phase inverter driving a 15kW permanent magnet machine shows that using diamond can increase active power density from 13kW/kg to 17kW/kg at a coolant temperature of 100Ā°C and a flowrate of 6 liters per minute.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- 1998 - On the use of diamond in a multichip power module (MCPW) based induction motor drive
- 2013 - Comparison of the thermal properties of diamond and aluminum nitride substrates
- 1995 - Semiconductor power losses in AC inverters