The Impact of Diamond Wire Quality on the Mechanical Strength of Thin Silicon Wafers for PV Cells
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2017-01-01 |
| Authors | Tetsuo Fukuda, Halubai Sekhar, Katsuto Tanahashi, K. Shirasawa, Hidetaka Takato |
| Citations | 2 |
Abstract
Section titled āAbstractāWe have investigated the mechanical strength of monocrystalline silicon wafers to improve the yield of photovoltaic (PV) cell fabrication process. In slicing monocrystalline silicon bricks, diamond abrasives fixed on a wire surface scratch front and backside surfaces of wafers more seriously than wafer edges. Therefore, damages and defects not at edges but on both surfaces cause a serious concern for lowering the mechanical strength. We prepared 200 and 120 Ī¼m thick wafers by cutting silicon bricks with a multi-wire saw, in which two kinds of diamond wires, the one with the abrasive-size ranging from 8 to 16 Ī¼m in diameter and the other from 6 to 12 Ī¼m were equipped. On the wire surface, the dispersion of 6 to 12 Ī¼m abrasives was improved to be larger compared with that of 8 to 16 Ī¼m abrasives. We report that the improved wire is essential to have wafers with higher mechanical strength and the reason why the wire improvement results in the strength increase.