Investigation of the Local Mechanical Properties of the SAC Solder Joint with AFM
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2017-02-10 |
| Journal | Materials science forum |
| Authors | Judit KƔmƔn, Attila BonyƔr |
| Institutions | Budapest University of Technology and Economics |
Abstract
Section titled āAbstractāConsidering the size of the natural appearance of the micro alloy components of a SAC solder joint, AFM was used to investigate their mechanical properties in the form of their natural appearance. Contact-mode point-spectroscopy was done to determine the elastic modulus and tapping-mode point-spectroscopy was done to investigate the tip-sample power dissipation.The measured Youngās modulus values of the Cu, IML, Ag 3 Sn and Sn components, were 125Ā±9 GPa, 111Ā±20 GPa, 67Ā±11 GPa and 57Ā±16 GPa, respectively. The dissipation measurements were accomplished by Si and diamond probes with different spring constants. The different characteristics of the results are discussed.