Smart Power Devices and ICs Using GaAs and Wide and Extreme Bandgap Semiconductors
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2017-02-13 |
| Journal | IEEE Transactions on Electron Devices |
| Authors | T. Paul Chow, Ichiro Omura, Masataka Higashiwaki, Hiroshi Kawarada, Vipindas Pala |
| Institutions | Rensselaer Polytechnic Institute, Waseda University |
| Citations | 149 |
Abstract
Section titled āAbstractāWe evaluate and compare the performance and potential of GaAs and of wide and extreme bandgap semiconductors (SiC, GaN, Ga2O3, and diamond), relative to silicon, for power electronics applications. We examine their device structures and associated materials/process technologies and selectively review the recent experimental demonstrations of high voltage power devices and IC structures of these semiconductors. We discuss the technical obstacles that still need to be addressed and overcome before large-scale commercialization commences.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- 2016 - Recent progress in Ga2O3 power devices [Crossref]
- 2013 - Depletion-mode Ga2O3 MOSFETs on $\beta $ -Ga2O3 (010) substrates with Si-ion-implanted channel and contacts