Characterization of new design small water volume arm for CMP dresser
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2017-05-01 |
| Authors | C. C. Chen, Tianju Chen, K. Yeh, M. H. Cheng, Junjie Huang |
| Institutions | Southern Taiwan Science Park |
Abstract
Section titled āAbstractāConsumption of ultrapure water (UPW) during semiconductor manufacturing processes is an important topic. A new design of water-dispensing arm employs a small volume of UPW to remove slurry residues inside pad grooves. This innovative water conditioning arm, in contrast to the conventional atomizer and diamond disc, not only reduces UPW consumption by 87% but also reduces scratch defects. The small water volume arm conditioning system injects UPW with diameters at micro levels. Experimental results show that removal amount under continuous polishing conditions is maintained even after 20 runs. The removal amount and profile not only is maintained but improved by over 2% in comparison with the conventional atomizer under no-dressing condition.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- 2004 - Development of a High Pressure Micro Jet (HPMJ) Pad Conditioning system for Interlayer Dielectric Chemical Mechanical Planarization Process