Effect of Processing Conditions on Bonding Strength at Al(Si)/Diamond Interfaces
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2019-06-01 |
| Journal | Key engineering materials |
| Authors | Christian Edtmaier, Jakob Segl, Robert Koos, M. Schƶbel, Christioph Feldbaumer |
| Institutions | University of Applied Sciences Technikum Wien |
Abstract
Section titled āAbstractāUnderstanding thermos-physical properties of MMCs includes considering interfacial processes and interactions between the constituents in MMCs. In this context, interfacial bonding is of vital interest for a deeper understanding of composites. Neutron diffraction experiments on Al/diamond composites were performed and reconciled with their thermo-physical properties and quantification of interfacial carbides formation. To create different interfacial conditions both, the contact time during processing the MMCs by liquid metal infiltration and the nominal composition of the matrix were changed, thus creating different amounts of interfacial Al 4 C 3 carbides. Neutron diffraction showed the increase in contact time and the addition of Si to Al both increase the bonding strength, although going with a significant decrease of the composite`s thermal conductivity.